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Home> Products> Electronic Potting Compound> Low Stress Electronic Potting Compound
Low Stress Electronic Potting Compound
Low Stress Electronic Potting Compound
Low Stress Electronic Potting Compound
Low Stress Electronic Potting Compound
Low Stress Electronic Potting Compound
Low Stress Electronic Potting Compound

Low Stress Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-9045

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
HONG YE SILICONE’s Low Stress Electronic Potting Compound is a professional delicate component circuit protection silicone and upgraded stress relieved module Potting Compound. Adoptinggentle cure protective encapsulation material formula, it features ultra-low curing shrinkage and thermal stress release. It stably operates at -60℃ to 220℃, avoiding damage to fragile chips and bonding wires. It matches our full product lineup including standard Electronic potting compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and insulating Silicone Encapsulant.
 
package2

Product Overview

This two-component low-stress silicone potting material includes addition and condensation curing formulas. Optimized for delicate and stress-sensitive electronic components, it eliminates rigid curing stress and thermal cycling extrusion damage. It delivers excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates. With low volatility and high toughness, it effectively absorbs internal thermal expansion and contraction stress to protect precision electronic structures.

Technical Specifications

As a stress relieved module potting compound, it achieves ultra-low curing stress and minimal shrinkage without squeezing delicate components. It features outstanding ozone and chemical erosion resistance, stable insulation and heat dissipation performance across wide temperature ranges. It bonds firmly with aluminum, copper and stainless steel. Viscosity, hardness and curing time support customized adjustment for precision encapsulation scenarios.
 
electronic silicone

Product Features & Advantages

1. Ultra-Low Stress Protection: This gentle cure protective encapsulation material releases curing and thermal stress thoroughly, preventing chip cracking and wire breakage.
2. Delicate Component Compatibility: Specially developed as delicate component circuit protection silicone for fragile precision electronic modules.
3. All-Round Environmental Resistance: Integrates waterproof, dustproof, anti-corrosion and shockproof functions for long-term stable circuit protection.
4. High Purity & Stability: Low volatile content ensures no contamination or performance interference for high-precision electronic equipment.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to maintain low-stress curing performance.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to realize bubble-free gentle encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours with low-shrinkage molding effect.

Application Scenarios & Commercial Value

Ideal for precision sensors, microchips, delicate automotive electronics and high-precision industrial control modules. Its low-stress performance eliminates component damage risks during curing and temperature cycling, reduces defective rates, improves product stability and durability, and cuts manufacturers’ precision electronic production costs.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting strict quality requirements for global precision electronic manufacturing.

Customization Options

We support personalized customization of viscosity, curing hardness and operating time to adapt to various delicate component encapsulation demands.

Production Process

Adopting high-purity low-stress formula and standardized dust-free production, each batch undergoes strict stress and stability tests to ensure consistent premium protection performance.

FAQ

Q1: What is the core advantage of low-stress potting compound?
A: It is a stress relieved module potting compound with gentle curing characteristics, preventing fragile chips
and bonding wires from extrusion damage.
Q2: Is it suitable for ultra-precision delicate electronic modules?
A: Yes. As dedicated delicate component circuit protection silicone, it is the optimal choice for stress-sensitive
precision electronic devices.
Q3: Will storage stratification affect low-stress performance?
A: No. Stir evenly before use, and the product will retain stable low-stress curing and comprehensive
protective properties.
 
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