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Home> Products> Electronic Potting Compound> High Build Electronic Potting Silicone
High Build Electronic Potting Silicone
High Build Electronic Potting Silicone
High Build Electronic Potting Silicone
High Build Electronic Potting Silicone
High Build Electronic Potting Silicone
High Build Electronic Potting Silicone

High Build Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Product Attributes

Model No.: HY-9050

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
HONG YE SILICONE’s High Build Electronic Potting Silicone is a professional deep fill module Potting Compound featuring thick-layer molding capability. It forms a durable thick section protective encapsulation layer and serves as a reliable substantial coating circuit protection material. Supporting -60℃ to 220℃ stable operation, it delivers heavy-duty insulation and structural protection. It complements our core product series: standard Electronic Potting Compound, heat-conductive Thermally Conductive Potting Compound, adhesiveElectronic Encapsulation Adhesive and universal Silicone Encapsulant.
 
HY-silicone term

Product Overview

This two-component high-build silicone potting material includes addition and condensation curing formulas. Designed for deep filling and thick-layer encapsulation, it solves insufficient coating and weak structural support of ordinary potting glue. It features excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates, as well as multiple metal surfaces. The cured substantial coating effectively absorbs thermal cycling stress, fully protecting internal chips and bonding wires with low volatility and high structural strength.

Technical Specifications

As a dedicated deep fill module potting compound, it supports ultra-thick section curing without sagging or hollowing. It boasts outstanding ozone resistance, chemical erosion resistance and wide-temperature stability. It integrates waterproof, dustproof, shockproof and heat-dissipating performance with strong bonding force on aluminum, copper and stainless steel. Viscosity, curing hardness and operating time support full customized adjustment for thick-layer packaging demands.
 
electronic silicone

Product Features & Advantages

1. High-Build Thick Layer Molding: This substantial coating circuit protection material achieves one-time deep filling for large-gap and high-thickness module encapsulation.
2. Strong Structural Protection: The thick section protective encapsulation layer provides excellent pressure resistance and anti-collision performance for heavy-load electronic modules.
3. Extreme Weather Adaptability: Stably operates at -60℃ to 220℃, relieving internal thermal stress to avoid cracking and peeling failure.
4. Premium Bonding & Stability: Low volatile content and high toughness ensure long-term tight adhesion with various circuit and metal substrates.

Step-by-Step Application Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Precise Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable thick-layer curing effect.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to eliminate bubbles for compact thick-layer encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, influenced by ambient temperature and humidity.

Application Scenarios & Commercial Value

Perfect for large power modules, industrial control electronics, deep-groove circuit boards and heavy-duty electronic equipment. Its high-build deep-fill performance eliminates incomplete encapsulation defects, enhances overall structural stability of electronic products, reduces failure rates in harsh environments, and lowers long-term maintenance and replacement costs.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international industrial standards, meeting global electronic manufacturing safety and environmental requirements.

Customization Options

We support personalized customization of viscosity, curing hardness and operating time to adapt to different thick-layer encapsulation and deep-fill process requirements.

Production Process

Adopting high-strength high-build formula and standardized dust-free production, each batch undergoes strict thick-layer curing and stability tests to ensure consistent industrial-grade quality.

FAQ

Q1: What is the core advantage of high-build potting silicone?
A: It is a deep fill module potting compound with excellent thick-layer molding ability, providing stronger
structural protection than ordinary potting materials.
Q2: Will thick-layer curing cause internal incomplete curing?
A: No. The optimized formula supports uniform deep curing without internal hollowing, ensuring integral
protective performance.
Q3: Does colloidal stratification affect high-build performance?
A: No. Even stirring before use can fully restore its thick-layer filling and substantial coating protection
performance.
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