Product Overview
This two-component high-viscosity silicone potting material cures firmly after mixing with curing agents, forming a tough protective layer for electronic components. It is widely used for encapsulation, sealing, filling and pressure resistance of electronic parts. Featuring excellent adhesion and thermal stability, it works perfectly on PC, PMMA, PCB, CPU and multiple metal surfaces. Different from ordinary low-fluidity potting gel, its unique anti-slump formula adapts to vertical installation and thick-layer filling scenarios without flowing or dripping.
Technical Specifications
As a professional thick section encapsulating material, this non slump protective resin features high viscosity and stable thixotropy for vertical construction. It withstands ozone erosion, chemical corrosion and extreme temperature cycling. The material effectively releases internal thermal stress during long-term operation, protecting delicate chips and bonding gold wires. With ultra-low volatile content and high mechanical strength, it provides reliable adhesion on aluminum, copper and stainless steel. Core parameters including curing hardness, gel viscosity and operating time support personalized customization.
Product Features & Advantages
1. Excellent Anti-Slump Performance: This vertical surface potting compound maintains stable shaping on vertical and inclined surfaces, solving dripping and sagging problems of common potting materials.
2. Full-Round Protective Properties: Integrates waterproof, moisture-proof, dustproof, insulating, heat-dissipating, shockproof and anti-corrosion functions to meet industrial-grade electronic protection standards.
3. Ultra-Wide Temperature Adaptability: Operates stably from -60℃ to 220℃, buffering thermal expansion and contraction stress to extend component service life.
4. High Purity & Strong Compatibility: Low volatile formula avoids circuit contamination, while outstanding bonding strength fits most mainstream circuit boards and metal substrates.
Step-by-Step Application Process
1. Pre-Stirring Treatment: Fully stir component A evenly to disperse settled fillers completely and shake component B thoroughly before mixing.
2. Precise Proportioning: Mix A and B components strictly in standard weight ratio to ensure consistent curing performance.
3. Vacuum Defoaming: After uniform stirring, place the mixed colloid in a 0.01MPa vacuum container for 3 minutes defoaming before pouring.
4. Standard Curing Operation: This addition-curing product supports room-temperature or heating curing. Full curing takes 24 hours, and curing speed is greatly affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Ideal for vertical-mounted LED modules, irregular circuit boards and large-gap electronic component encapsulation. It eliminates material waste and rework caused by gel sagging, simplifies complex construction processes, improves overall production efficiency, and effectively reduces failure rates and maintenance costs of special-structure electronic products.
Certifications and Compliance
All HONG YE SILICONE products strictly comply with ISO9001 quality management system, CE and RoHS international environmental standards, fully meeting global commercial and industrial electronic manufacturing specifications.
Customization Options
Customizable curing hardness, colloid viscosity and operating pot life are available to match personalized thick-section and vertical encapsulation requirements.
Production Process
Adopting standardized dust-free production and strict batch testing on viscosity, thixotropy and anti-slump performance, every batch of products undergoes full quality inspection to ensure stable and reliable industrial-grade quality.
FAQ
Q1: What curing types are available for this product?
A: We provide both addition-curing and condensation-curing versions to adapt to different
electronic manufacturing processes.
Q2: Can stratified glue after long storage be used normally?
A: Yes. Uniform stirring before use can completely restore original performance without quality impact.
Q3: What are the key safety and storage notes?
A: The product is non-hazardous. Keep sealed during storage and use mixed glue at one time.
Avoid ingestion and eye contact; rinse with clean water immediately if accidental contact occurs.
Q4: What is the core advantage compared with ordinary potting silicone?
A: Its unique high-viscosity and anti-slump property makes it the optimal solution for vertical surfaces
and thick-section encapsulation scenarios that ordinary Electronic potting compound cannot handle.
Shenzhen Hong Ye Jie Technology Co., Ltd
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