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Home> Products> Electronic Potting Compound> High Compressive Strength Electronic Potting Silicone
High Compressive Strength Electronic Potting Silicone
High Compressive Strength Electronic Potting Silicone
High Compressive Strength Electronic Potting Silicone
High Compressive Strength Electronic Potting Silicone
High Compressive Strength Electronic Potting Silicone
High Compressive Strength Electronic Potting Silicone

High Compressive Strength Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.: HY-9020

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic Potting Compound for General Encapsulation
Product Description
Our High Compressive Strength Electronic Potting Silicone is a two-part addition cure Silicone Encapsulant. It delivers excellent waterproofing, thermal conductivity, insulation and compression resistance. It adheres well to PCB, CPU, PC and PMMA, operating stably from -60℃ to 220℃. Suitable for electronic component sealing and filling. We also supply Pad Printing Silicone, Mold Making Silicone rubber, medical grade silicone and liquid silicone foam with OEM support.
 
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High Compressive Strength Electronic Potting Silicone

Product Overview

High Compressive Strength Electronic Potting Silicone, also known as Electronic Encapsulation Adhesive and Thermally Conductive Potting Compound, is a liquid two-component silicone encapsulant. After mixing with curing agent, it cures into a solid protective layer for electronic parts. This high compressive strength encapsulating material features reliable compression load resistance and dimensional stability. It bonds tightly to PCB, CPU, PC and PMMA substrates, offering multi-protection for electronics. HONG YE SILICONE provides this potting silicone alongside our mold making silicone rubber and thermal conductive silicone series for electronic protection projects.

Technical Specifications

Two-component addition cure system, supplied as Part A and Part B, mixed by weight ratio before use.
Service temperature range: -60℃ to 220℃ continuous operation.
Cured properties: high compressive strength, low volatile content, stable dimension, good insulation and thermal conductivity.
Substrate adhesion: excellent bonding to PC, PMMA, PCB, CPU, aluminum, copper and stainless steel.
Hardness, viscosity and working time can be adjusted on request.

Product Features

  • Outstanding compression resistance, waterproof, moisture-proof, dust-proof and insulation performance
  • Good thermal conductivity and shock absorption, absorbing thermal cycling stress to protect chips and gold bonding wires
  • Wide working temperature range of -60℃ to 220℃ with strong ozone and chemical erosion resistance
  • Low volatile content, high strength and stable dimension; strong adhesion to aluminum, copper and stainless steel
  • Two systems available: addition curing and condensation curing electronic potting silicone
  • Consistent batch performance, matched with our Food grade mold silicone and pad printing silicone for one-stop silicone sourcing

Application Scenarios

This compression load resistant potting silicone is widely used for encapsulation, sealing and filling of electronic components. It performs well in LED modules, circuit boards and power units, securing internal parts against pressure, moisture and temperature fluctuation. Many customers pair it with our liquid Silicone Foam to build complete electronic sealing solutions. It fits consumer electronics, industrial control and lighting assemblies, helping buyers reduce failure rate, extend component service life and lower after-sales cost.
 
electronic silicone

How to Use

  1. Fully stir Part A to re-disperse settled fillers and shake Part B evenly before mixing.
  2. Mix Part A and Part B strictly by the required weight ratio.
  3. Vacuum degas the blended compound at 0.01MPa for around 3 minutes if bubble-free pouring is required.
  4. Pour the mixture onto the parts. It cures at room temperature or under heating. Full curing takes 24 hours, and ambient temperature and humidity affect curing speed.

Certifications and Compliance

This electronic potting silicone follows our factory quality system and complies with ISO9001, CE and UL standards. Every batch goes through pre-production sample confirmation and final inspection before shipment.

Customization Options

Formulation customization is supported. Hardness, viscosity and working time can be adjusted to your project requirements, and OEM service is available.

Production Process

Raw silicone materials are prepared and tested first. Each component is compounded, stirred and inspected under QC monitoring, and finished materials pass lab performance testing before packing.

FAQ

Q: Is this potting silicone an addition cure type?
A: Yes, this high compressive strength potting silicone is an addition curing system. A condensation
curing version is also available.
Q: What should I note for storage?
A: Keep containers tightly sealed and use up the mixed compound in time. Slight layer separation
after long storage is normal; stir fully before use.
Q: Is it dangerous goods?
A: It is non-hazardous. Avoid contact with mouth and eyes, and rinse with clean water immediately
in case of accidental contact.
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