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Home> Products> Electronic Potting Compound> Low Extractables Electronic Potting Silicone
Low Extractables Electronic Potting Silicone
Low Extractables Electronic Potting Silicone
Low Extractables Electronic Potting Silicone
Low Extractables Electronic Potting Silicone
Low Extractables Electronic Potting Silicone
Low Extractables Electronic Potting Silicone

Low Extractables Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9320

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
HONG YE SILICONE Low Extractables Electronic Potting Silicone, also known as low extractable encapsulating material and clean extraction protective compound, is a premium Silicone Encapsulant. It minimizes soluble extractables to avoid contamination of delicate electronic parts, while delivering waterproof, insulating and thermally stable protection for PCBs, CPUs and LED modules.
 
package3

Product Overview

This two-part addition cure Electronic Potting Compound is also called Electronic Encapsulation Adhesive. After mixing with curing agent, the liquid system cures into a flexible elastomer to seal and shield electronics. Besides this low extract potting silicone, we supply Mold Making Silicone rubber, Pad printing silicone rubber and liquid silicone foam to support your full silicone sourcing.

Product Features

  • Ultra-low extractable content, reduces contamination risk for optical and precision electronic assemblies.
  • Wide working temperature range from -60°C to 220°C, relieves thermal cycling stress and protects bonding gold wires.
  • Waterproof, dustproof, ozone and chemical corrosion resistance, good shock and pressure buffer.
  • Low volatiles, high tensile strength, reliable adhesion to aluminum, copper, stainless steel, PC and PMMA.
  • Stable electrical insulation, compatible with our Thermally Conductive Potting Compound series for thermal management needs.

Application Scenarios

This low extractable encapsulating material works for encapsulation, sealing, filling and stress protection of sensitive electronic components. It fits optical sensors, LED displays and high-reliability control boards where contamination must be avoided. It helps buyers cut field rejection rates and extend device service life.
 
electronic silicone

How To Use

  1. Stir Part A fully to re-disperse settled fillers, shake Part B evenly.
  2. Mix A and B strictly following the designated weight ratio.
  3. Degas the blended compound under 0.01 MPa vacuum for 3 minutes for bubble-free potting.
  4. Pour and cure at room temperature or elevated heat; full cure takes 24 hours. Curing speed is affected by ambient temperature and humidity.

Certifications and Compliance

Manufactured under ISO9001 quality control system, with CE and UL certifications. This silicone encapsulant meets common international industrial safety standards.

Customization Options

Hardness, viscosity and working time can be adjusted to match your technical specifications. Pre-production samples are available before bulk orders.

Production Process

Raw silicone materials go through compounding, homogenization and extractable content testing. Every batch is inspected for purity and electrical performance before packaging.

FAQ

Q: Is this low extractables potting silicone addition cure?
A: Yes, it is addition curing RTV silicone. Condensation cure electronic Potting Compound can be
supplied on request.
Q: How should I store unused material?
A: Keep Part A and Part B sealed tightly. Mixed potting material should be used up promptly. Slight
separation after long storage is normal, stir thoroughly before use.
Q: Why low extractables matter for my product?
A: Low extractables prevent dissolved substances from migrating out, which avoids fogging, surface
pollution and performance drift of precision electronic and optical parts.
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