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Home> Products> Electronic Potting Compound> Two Component Electronic Potting Silicone
Two Component Electronic Potting Silicone
Two Component Electronic Potting Silicone
Two Component Electronic Potting Silicone
Two Component Electronic Potting Silicone
Two Component Electronic Potting Silicone
Two Component Electronic Potting Silicone

Two Component Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9045

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic Potting Compound for General Encapsulation
Product Description
HONG YE SILICONE Two Component Electronic Potting Silicone is a dual part encapsulating material. As a mix ratio potting silicone, it cures after combining component A and B, forming a component system protective compound that seals, insulates and waterproofs electronic assemblies. Ideal for PCB, CPU and LED modules, it offers stable thermal performance and strong adhesion to PC, PMMA and metals.
 
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Product Overview

This two component electronic potting silicone is also known as Electronic Potting Compound, electronic encapsulant or Silicone Encapsulant. It is supplied as a dual part encapsulating material: after adding the curing agent, the liquid cures into a solid elastomer that shields sensitive components from moisture, dust and shock. This mix ratio potting silicone delivers waterproofing, thermal conductivity and electrical insulation in one system. HONG YE SILICONE supplies it alongside Mold Making Silicone rubber, Pad Printing Silicone, liquid silicone foam and medical grade silicone for one-stop sourcing.

Product Features

  • Dual part system: exact mix ratio potting silicone with predictable, controllable curing for consistent results.
  • Wide working range: -60°C ~ 220°C, absorbing thermal cycling stress to protect chips and bonding gold wires.
  • Excellent waterproof, moisture-proof, dustproof, corrosion resistance and electrical insulation.
  • Good ozone and chemical resistance, low volatile content and high mechanical strength.
  • Strong adhesion to PC, PMMA, PCB, aluminum, copper and stainless steel substrates.

Application Scenarios

This component system protective compound serves encapsulation, sealing, filling and stress buffering of electronic parts. It fits PCB boards, CPU modules, LED displays, power units and sealed sensors. Buyers benefit from fewer field failures, longer service life and lower after-sales maintenance cost. For lightweight sealing needs, we also offer liquid Silicone Foam.
 
electronic silicone

How To Use

  1. Fully stir component A to remix settled fillers; shake component B well.
  2. Mix A and B strictly following the specified weight ratio.
  3. Degas the mixed compound in a vacuum vessel at 0.01 MPa for about 3 minutes if bubble-free potting is needed.
  4. Pour and cure at room temperature or elevated temperature; full cure takes 24 hours. Temperature and humidity affect curing speed.

Certifications and Compliance

Our factory holds ISO9001, CE and UL certifications. This silicone encapsulation adhesive meets standard industrial requirements, consistent with our quality control for HTV solid silicone rubber and other silicone series.

Customization Options

Hardness, viscosity and working time after cure can be adjusted to your project. We support custom formulation and pre-production samples before mass production.

Production Process

Raw silicone passes compounding, mixing and testing, then pre-production samples and final inspection before shipment. Every batch is tested for insulation, thermal stability and consistency.

FAQ

Q: Is this two component silicone addition cure or condensation cure?
A: It is addition curing RTV silicone; condensation type electronic Potting Compound is also available.
Q: How should A and B components be stored?
A: Keep both components sealed and dry. Once mixed, use the compound fully in one batch to avoid waste.
Q: Does it adhere to common plastic and metal substrates?
A: It shows reliable adhesion to PC, PMMA and metals. Send your substrate sample for adhesion testing if needed.
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