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Home> Products> Electronic Potting Compound> High Crosslink Density Electronic Potting Silicone
High Crosslink Density Electronic Potting Silicone
High Crosslink Density Electronic Potting Silicone
High Crosslink Density Electronic Potting Silicone
High Crosslink Density Electronic Potting Silicone
High Crosslink Density Electronic Potting Silicone
High Crosslink Density Electronic Potting Silicone

High Crosslink Density Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9035

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound1
Product Description
 
HONG YE SILICONE High Crosslink Density Electronic Potting Silicone is a tightly crosslinked potting silicone and dense network protective compound. This Thermally Conductive Potting Compound delivers outstanding barrier, insulation and structural stability for PCB and CPU encapsulation. We also supply Mold Making Silicone rubber, Pad Printing Silicone, liquid silicone foam and medical grade silicone with custom formulation support.
 
HY-SILICONE company

Product Overview

This high crosslink density electronic potting silicone is an addition-cure Silicone Encapsulant, also known as Electronic Potting Compound or Electronic Encapsulation Adhesive. After mixing Part A and Part B, liquid resin cures into a dense network protective compound with tight crosslink structure, sealing and safeguarding electronic components. Its compact molecular network brings superior resistance to moisture, chemical penetration and deformation. Our RTV silicone lineup includes this encapsulant alongside solid HTV silicone rubber for diversified industrial demands.

Product Features

  • High crosslink density forms a dense network for excellent barrier and dimensional stability.
  • Wide service temperature: -60°C ~ 220°C, relieving thermal cycling stress to protect chips and gold bonding wires.
  • Waterproof, dustproof, corrosion resistant, ozone resistant, with reliable electrical insulation and thermal dissipation.
  • Low volatile content, high mechanical strength, great adhesion to aluminum, copper, stainless steel, PCB, PC and PMMA.

Application Scenarios

It works for encapsulation, sealing, filling and pressure buffering of electronic assemblies. Suitable for PCB, CPU, LED modules and power units requiring stable long-term sealing. Buyers gain fewer field failures, extended component lifespan and reduced after-sales maintenance expense.
 
electronic potting compound

How To Use

  1. Stir Part A fully to re-disperse settled fillers and shake Part B well before mixing.
  2. Mix A and B strictly following the specified weight ratio.
  3. Vacuum degas mixed compound at 0.01 MPa for 3 minutes if bubble-free pouring is needed.
  4. Cure at ambient or elevated temperature; full curing takes 24 hours. Ambient temperature and humidity affect curing speed.

Certifications and Compliance

HONG YE SILICONE holds ISO9001, CE and UL certifications. This silicone encapsulant meets standard industrial encapsulation requirements.

Customization Options

We can adjust hardness, viscosity and pot life according to your project requirements for this thermally conductive Potting Compound.

Production Process

Raw silicone undergoes incoming QC, compounding, mixing and lab testing. Pre-production samples are available and final inspection is performed before shipment, following the same strict standard applied to liquid Silicone Foam and medical grade silicone.

FAQ

Q1: Is this high crosslink density potting silicone addition cure?
A: Yes, it is addition curing RTV silicone. Condensation type electronic potting compound is also available.
Q2: How should the silicone be stored?
A: Keep A and B components sealed. Use mixed material in one batch. Layer separation after storage is
normal; stir thoroughly before use.
Q3: Any safety tips?
A: It is non-hazardous. Avoid contact with eyes and mouth. Rinse with clean water or seek medical help
if accidental exposure happens.
 
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