High Barrier Electronic Potting Silicone

HONG YE SILICONE High Barrier Electronic Potting Silicone is a high barrier encapsulating material, also known as moisture blocking potting silicone and gas permeation resistant compound. This Silicone Encapsulant forms a dense protective layer after curing. It delivers excellent moisture & gas blocking performance, electrical insulation and thermal stability, with great adhesion to PCB, PC, PMMA, CPU and most metals. It is widely used for long-term protection of sensitive electronic modules.

Product Overview

High Barrier Electronic Potting Silicone belongs to Electronic Potting Compound and Electronic Encapsulation Adhesive. This two-part liquid silicone cures once mixed with curing agent. Its core highlight is outstanding resistance to moisture vapor and gas permeation, apart from standard waterproof, dustproof, insulation and thermal management functions. As one of our premium potting grades, it works well together with our Pad Printing Silicone, Mold Making Silicone rubber, liquid Silicone Foam and HTV solid silicone rubber for your full silicone material sourcing.

Product Features

• Superior barrier property: low gas & moisture permeability, ideal for devices requiring long-term hermetic protection
• Wide service temperature: -60℃ to 220℃, relieves thermal cycling stress to safeguard chips and gold bonding wires
• Resists ozone, chemical corrosion; low volatile content, high mechanical strength
• Reliable adhesion to PCB, PC, PMMA, aluminum, copper and stainless steel
• Shockproof, insulating, anti-corrosion, keeps internal electronics stable in harsh humid environments

Application Scenarios

This moisture blocking potting silicone is used for encapsulation, filling and pressure buffering of electronic components. It suits LED modules, power supplies, sensors and circuit boards exposed to humid or corrosive atmosphere. With reliable barrier performance, it cuts premature electronic failure and reduces your after-sales cost.

How To Use

1. Stir part A thoroughly to redistribute settled fillers; shake part B evenly.
2. Mix A and B strictly following the specified weight ratio.
3. Degas mixed compound at 0.01 MPa vacuum for 3 minutes if bubble-free potting is required.
4. Pour and cure at room temperature or elevated heat; full curing takes 24h. Curing speed is affected by ambient temperature and humidity.

Certifications and Compliance

Manufactured under ISO9001 quality management system, with CE and UL available. This gas permeation resistant compound complies with mainstream industrial standards for electronic encapsulation.

Customization Options

We can adjust hardness, viscosity and pot life according to project demands. Pre-production samples are available before bulk order.

Production Process

Raw silicone materials go through compounding, homogenization and lab testing. Every batch passes insulation and barrier performance inspection before packing and delivery. Strict QC ensures consistent quality same as our Thermally Conductive Potting Compound series.

FAQ

Q: Is this high barrier silicone addition cure or condensation cure?

A: This grade is addition curing RTV silicone. Condensation cure electronic Potting Compound

is also available on request.

Q: How to store unused material?

A: Keep components sealed. Once mixed, finish potting in one session to avoid waste. Minor layer

separation after storage is normal; stir well before use.

Q: Can it be used for outdoor electronics?

A: Yes. Its excellent moisture and gas barrier characteristic makes it fit outdoor electronic assemblies.