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Home> Products> Electronic Potting Compound> Low Surface Tension Electronic Potting Silicone
Low Surface Tension Electronic Potting Silicone
Low Surface Tension Electronic Potting Silicone
Low Surface Tension Electronic Potting Silicone
Low Surface Tension Electronic Potting Silicone
Low Surface Tension Electronic Potting Silicone
Low Surface Tension Electronic Potting Silicone

Low Surface Tension Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9025

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound3
Product Description
HONG YE SILICONE Low Surface Tension Electronic Potting Silicone is an addition-cure Silicone Encapsulant. As a void free protective compound, it delivers wetting enhancement for PCB, CPU & LED modules. This Thermally Conductive Potting Compound provides waterproofing, insulation, shock resistance, and wide temperature tolerance. We also supply Mold Making Silicone rubber, Pad Printing Silicone, liquid silicone foam and medical grade silicone, with custom formula service.
 
HY-factory

Product Overview

This low surface tension encapsulating material, also known as Electronic Potting Compound or silicone encapsulant, is two-component addition curing potting silicone. After mixing Part A and Part B, the liquid compound cures to protect electronic assemblies. Thanks to low surface tension, it achieves excellent wetting enhancement and void-free filling. It seals, insulates, waterproofs and buffers components. Our RTV-2 silicone series includes this electronic potting silicone alongside mold making silicone rubber, pad printing silicone, liquid Silicone Foam and medical grade silicone for diverse industrial buyers.

Product Features

  • Outstanding waterproof, moisture-proof, dustproof, corrosion resistance and electrical insulation.
  • Wide working range: -60°C ~ 220°C, absorbs thermal cycling stress to safeguard chips and bonding gold wires.
  • Good ozone and chemical resistance, low volatile content, high strength.
  • Strong adhesion to aluminum, copper, stainless steel, PCB, PC and PMMA substrates.
  • Low surface tension enables full wetting, reducing voids in dense electronic structures.
electronic potting compound

Application Scenarios

It serves encapsulation, sealing, filling and pressure buffering of electronic components. Ideal for PCB, CPU, LED display modules. Perfect for assemblies requiring stable thermal performance and tight sealing. Buyers benefit from fewer field failures, longer component service life and lower after-sales maintenance cost.

How To Use

  1. Fully stir Part A to remix settled fillers, shake Part B well.
  2. Mix A and B strictly by required weight ratio.
  3. Vacuum degas the mixed compound at 0.01 MPa for 3 minutes before pouring if needed.
  4. Cure at room temperature or elevated temperature. Full cure takes 24 hours; temperature and humidity affect curing speed.

Certifications and Compliance

HONG YE SILICONE holds ISO9001, CE and UL certifications. This silicone encapsulant meets standard industrial requirements for electronic encapsulation projects.

Customization Options

We can adjust hardness, viscosity and pot life according to buyer specifications. Contact us for tailored formula of this thermally conductive Potting Compound.

Production Process

Raw silicone materials pass incoming QC. After compounding, mixing and testing, pre-production samples are supplied. Final inspection is conducted before shipment, consistent with our standard for liquid silicone foam and other silicone products.

FAQ

Q1: Is this potting silicone addition cure or condensation cure?
A: It is addition curing RTV silicone. We also provide condensation type electronic potting compound.
Q2: What storage requirements are needed?
A: Keep A/B components sealed. Once mixed, use the compound fully in one batch. Separated layers
after storage can be re-stirred without performance loss.
Q3: Safety instructions?
A: Non-hazardous material, avoid contact with eyes and mouth. Rinse with clean water or seek medical
help upon accidental exposure.
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