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Home> Products> Electronic Potting Compound> Low Creepage Electronic Potting Silicone
Low Creepage Electronic Potting Silicone
Low Creepage Electronic Potting Silicone
Low Creepage Electronic Potting Silicone
Low Creepage Electronic Potting Silicone
Low Creepage Electronic Potting Silicone
Low Creepage Electronic Potting Silicone

Low Creepage Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.: HY-9020

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound
Product Description
 
HONG YE SILICONE Low Creepage Electronic Potting Silicone is a two-component addition-cure Electronic Potting Compound. As a creepage distance protective encapsulant, it suppresses tracking and keeps high surface insulation resistance for high-voltage electronics. This Silicone Encapsulant and Thermally Conductive Potting Compound delivers waterproof, insulation and thermal protection, works steadily from -60℃ to 220℃, and bonds firmly to PCB, PC, PMMA and metals for reliable high-voltage assemblies.
 
package2

Product Overview

Low Creepage Electronic Potting Silicone is a pourable liquid potting material. Mixed with curing agent, it cures into flexible elastomer for encapsulation, sealing and filling electronic components. This tracking suppression potting silicone features excellent adhesion and thermal stability on PC, PMMA, PCB and CPU. It shields electronics against moisture, dust and corrosion while resisting surface tracking, keeping high-voltage insulation reliable for power and industrial electronics.

Product Features

  1. Low creepage design provides long creepage distance protection and high surface insulation resistance.
  2. Tracking suppression formula resists electrical tracking on cured surfaces for high-voltage safety.
  3. Waterproof, dustproof, insulating, thermally conductive, shock resistant, ozone and chemical corrosion resistant.
  4. Wide operating temperature range -60℃~220℃, absorbs thermal cycling stress to protect chips and gold bonding wires.
  5. High adhesion to aluminum, copper, stainless steel, PC, PMMA, PCB and CPU; low volatile content.

How To Use

  1. Fully stir component A to homogenize settled fillers and shake component B before mixing.
  2. Mix A and B strictly following the specified weight ratio.
  3. Vacuum defoam the mixed compound under 0.01MPa for 3 minutes before pouring if required.
  4. Pour the mixture and cure at room temperature or elevated temperature. Full curing takes 24 hours; temperature and humidity affect curing speed.
electronic potting compound

Application Scenarios

This surface insulation resistance compound is widely used for encapsulation, sealing and filling of high-voltage electronic components in power supplies, industrial controllers, LED drivers and charging modules. It maintains stable insulation under humidity and contamination, reduces tracking risk and improves electrical safety for manufacturers.

Technical Specifications

This creepage distance protective encapsulant features low volatile content, high mechanical strength and stable electrical performance across temperature cycles. Cured hardness, viscosity and pot life can be customized to meet client project requirements.

Certifications and Compliance

Our Electronic Encapsulation Adhesive complies with RoHS and REACH standards. Test reports and COA documents are available for customer qualification audit.

Customization Options

HONG YE SILICONE provides custom formulation for this tracking suppression potting silicone. Adjust cured hardness, viscosity and operation time for your high-voltage electronic projects.

Production Process

Raw materials pass incoming inspection. Each batch undergoes mixing, vacuum treatment and lab performance testing. Finished products get full quality inspection before packing to ensure consistent batch quality.

FAQ

Q: What is the key advantage of Low Creepage Electronic Potting Silicone?
A: It offers high surface insulation resistance and tracking suppression for high-voltage safety.
Q: What curing type does it adopt?
A: It is addition-cure silicone, curable at room temperature or by heating.
Q: Can leftover mixed glue be stored for later use?
A: Mixed compound must be used in one batch. Unmixed raw materials need sealed storage.
Q: Is this potting silicone hazardous?
A: It is non-hazardous. Avoid contact with eyes and mouth. Rinse thoroughly with clean water upon
accidental contact.
 
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