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Home> Products> Electronic Potting Compound> High Peel Strength Electronic Potting Silicone
High Peel Strength Electronic Potting Silicone
High Peel Strength Electronic Potting Silicone
High Peel Strength Electronic Potting Silicone
High Peel Strength Electronic Potting Silicone
High Peel Strength Electronic Potting Silicone
High Peel Strength Electronic Potting Silicone

High Peel Strength Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.: HY-215

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
High Peel Strength Electronic Potting Silicone from HONG YE SILICONE is a two-part addition cure Silicone Encapsulant. This strong bond potting silicone compound delivers reliable adhesion on PCB, CPU, PC and PMMA. It works as Electronic Potting Compound and silicone encapsulant, offering waterproofing, insulation and thermal stability to protect electronic assemblies.
 
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Product Overview

High Peel Strength Electronic Potting Silicone is also named electronic Potting Compound, silicone encapsulant and Electronic Encapsulation Adhesive. This two-component addition cure liquid silicone forms a flexible protective layer after mixing with curing agent. Compared with regular Thermally Conductive Potting Compound, it features outstanding peel strength and adhesion durability. It seals, fills and cushions electronic components against moisture, dust, pressure and thermal cycling damage. HONG YE SILICONE, a professional manufacturer of Mold Silicone rubber, Pad printing silicone rubber and liquid Silicone Foam , supplies consistent encapsulation materials for global electronic buyers.

Product Features

  • Excellent adhesion to PCB, CPU, PC, PMMA, aluminum, copper and stainless steel; high peel strength prevents delamination.
  • Wide operating range from -60°C to 220°C, absorbs thermal stress to safeguard chips and bonding wires.
  • Waterproof, dustproof, insulating, shock-resistant, corrosion and ozone resistant.
  • Low volatility, stable performance, good thermal dissipation.
  • Our solid silicone rubber and silicone tubing production experience supports strict quality control for this encapsulating material.

Application Scenarios

This strong bond potting silicone compound fits LED modules, power supplies, circuit boards and control units. It is widely used for encapsulation and gap filling in consumer electronics and industrial electronics. Reliable adhesion reduces rework risk and extends service life of finished electronics, helping buyers cut after-sales cost.
 
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How To Use

  1. Fully stir Part A to redistribute settled fillers and shake Part B evenly.
  2. Mix Part A and Part B strictly by required weight ratio.
  3. Degas blended silicone under vacuum at 0.01 MPa for 3 minutes if needed before pouring.
  4. Cure at room temperature or elevated temperature; full cure takes 24 hours. Temperature and humidity affect curing speed.

Certifications and Compliance

All potting silicone products comply with CE and ISO9001 standards, meeting common international electronic material requirements.

Customization Options

We can adjust hardness, viscosity and working time according to project requirements for tailored adhesion and processing needs.

Production Process

Raw silicone materials go through compounding, stirring, filtering and QC inspection before packaging. Each batch gets internal performance test before shipment.

FAQ

Q: Will mixed leftover silicone cure later?
A: Yes. Prepare only the required amount, as mixed compound cannot be stored for long.
Q: Does layering after storage affect performance?
A: No. Stir thoroughly before use.
Q: Is this silicone hazardous?
A: Non-hazardous, avoid contact with eyes and mouth. Rinse with clean water once contacted.
 
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