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Home> Products> Electronic Potting Compound> Low Hygroscopic Electronic Potting Silicone
Low Hygroscopic Electronic Potting Silicone
Low Hygroscopic Electronic Potting Silicone
Low Hygroscopic Electronic Potting Silicone
Low Hygroscopic Electronic Potting Silicone
Low Hygroscopic Electronic Potting Silicone
Low Hygroscopic Electronic Potting Silicone

Low Hygroscopic Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.: HY-9325

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound3
Product Description
 
HONG YE SILICONE Low Hygroscopic Electronic Potting Silicone, also known as moisture absorption resistant potting silicone and humidity stable protective compound, is a premium Silicone Encapsulant. It features extremely low moisture absorption to maintain stable electrical performance in high-humidity environments, offering waterproof, insulating and thermally stable protection for PCBs, CPUs and LED assemblies.
 
HY-silicone term

Product Overview

This two-part addition cure Electronic Potting Compound is also called Electronic Encapsulation Adhesive. Once mixed with curing agent, the liquid silicone cures into an elastic layer to encapsulate and protect sensitive electronics. Alongside this low hygroscopic encapsulating material, we supply Mold Making Silicone rubber, Pad printing silicone rubber, liquid Silicone Foam and Thermally Conductive Potting Compound for your one-stop silicone procurement.

Product Features

  • Ultra-low hygroscopicity, prevents moisture ingress and keeps consistent insulation performance under humid conditions
  • Wide service temperature range of -60℃ to 220℃, relieves thermal cycling stress and safeguards chips and bonding gold wires
  • Excellent waterproof, dustproof, ozone and chemical corrosion resistance with shock and pressure buffering capacity
  • Low volatile content, high mechanical strength, great adhesion to aluminum, copper, stainless steel, PC and PMMA
  • Stable electrical properties, designed for long-term service in tropical, damp outdoor and industrial environments

Application Scenarios

This humidity stable protective compound is used for encapsulation, sealing, filling and stress relief of electronic components. It suits outdoor control modules, LED displays and automotive circuit boards exposed to high humidity. It reduces field failures caused by moisture and extends service life of finished electronics.
 
electronic silicone

How To Use

  1. Stir Part A thoroughly to redistribute settled fillers, shake Part B well before mixing.
  2. Mix Part A and Part B strictly according to the specified weight ratio.
  3. Degas the mixed compound at 0.01 MPa vacuum for 3 minutes to remove bubbles before pouring.
  4. Cure at room temperature or elevated temperature; full curing takes 24 hours. Curing rate is affected by ambient temperature and humidity.

Certifications and Compliance

Produced under ISO9001 quality management system, with CE and UL approvals. This silicone encapsulant complies with mainstream international industrial standards.

Customization Options

Hardness, viscosity and pot life can be adjusted to meet your technical requirements. Pre-production samples are available prior to bulk orders.

Production Process

Raw silicone materials go through compounding, homogenization and hygroscopicity testing. Each batch passes strict electrical and physical inspection before packing.

FAQ

Q: Is this low hygroscopic potting silicone addition cure?
A: Yes, it is addition curing RTV silicone. Condensation cure electronic Potting Compound can be supplied on request.
Q: How should we store the silicone?
A: Keep Part A and B tightly sealed. Mixed material should be used up quickly. Slight layer separation after long
storage is normal; stir fully before use.
Q: What is the main advantage of low hygroscopic design?
A: Low moisture absorption avoids insulation drop and electric leakage triggered by humid air, which is critical for
electronics working in high-humidity areas.
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