Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a high-thermal-conductivity 2-component Addition Curing Silicone, featuring excellent heat dissipation performance (thermal conductivity ≥1.5 W/(m·K)), efficient heat transfer, low thermal resistance, suitable for electronic heat dissipation, high-power equipment and heat-dissipation scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS thermal conductivity test, compatible with Electronic Potting Compound and high-precision Mold Silicone, serving B2B buyers in electronics, high-power and heat-dissipation industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a high-thermal-conductivity heat-dissipation core product, specially developed for electronic heat dissipation, high-power equipment and heat-dissipation scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with thermal-conductive fillers and heat-dissipation modifiers, featuring ultra-strong thermal conductivity, efficient heat transfer, fine uniform closed-cell structure, good elasticity and thermal stability. It has a thermal conductivity of ≥1.5 W/(m·K), low thermal resistance (≤0.15 K·m²/W), effectively transferring heat and reducing equipment temperature, solving the problem of traditional foaming materials’ poor heat dissipation in high-power scenarios. Compatible with most of our electronic products, it is ideal for heat-dissipation components, thermal buffers and heat-dissipation scenarios.
Technical Specifications
Type: 2-component addition curing silicone
High Thermal Conductivity & Heat Dissipation: Thermal conductivity ≥1.5 W/(m·K), thermal resistance ≤0.15 K·m²/W, efficient heat transfer, heat dissipation efficiency ≥90%, thermal stability ≥95%, no loss of thermal conductivity
Foaming Feature: Fine uniform closed-cell pores (20-40μm), thermal-conductive structure, dense pore distribution, uniform heat transfer, no heat accumulation, structural integrity in heat-dissipation environments
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS thermal conductivity certification
Key Traits: High thermal conductivity (≥1.5 W/(m·K)), efficient heat dissipation, low thermal resistance
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Thermal Conductivity: Thermal conductivity ≥1.5 W/(m·K), efficient heat transfer, solving the problem of traditional foaming materials’ poor heat dissipation in high-power scenarios.
2. Efficient Heat Dissipation: Heat dissipation efficiency ≥90%, low thermal resistance, effectively reducing equipment temperature, protecting electronic components from overheating.
3. Thermal Conductivity & Elasticity Balance: While maintaining ultra-strong thermal conductivity, it retains good elasticity and structural stability, no brittle fracture, balancing heat dissipation and usability.
4. Compatibility with Heat-Dissipation Products: Compatible with HONG YE SILICONE’s electronic Potting Compound and high-precision mold silicone, forming a complete heat-dissipation solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat-dissipation components, no professional heat-dissipation operation skills required, improving production efficiency.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting thermal conductivity and heat dissipation).
2. Mix and stir thoroughly for 3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure uniform thermal conductivity and closed-cell structure, no heat accumulation).
3. Pour the mixture into heat-dissipation component mold (paired with electronic potting compound), foam and cure at room temperature or by heating (heating helps enhance thermal stability).
4. After full curing, test thermal conductivity (≥1.5 W/(m·K)) to confirm qualification, then use in heat-dissipation and high-power scenarios.
Application Scenarios
Focus on heat-dissipation scenarios: Electronic heat-dissipation buffers (paired with electronic potting compound), high-power equipment heat-dissipation parts (paired with high-precision mold silicone), heat-dissipation packaging (paired with Liquid Tank Silicone), communication equipment heat-dissipation components (paired with robot silicone), and heat-dissipation robot parts (paired with robot silicone). It helps electronics industry buyers reduce equipment temperature and protect electronic components.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS thermal conductivity certification, excellent thermal conductivity and heat dissipation, meeting the heat-dissipation procurement requirements of B2B buyers in electronics, high-power and heat-dissipation industries, facilitating export to global markets.
Customization Options
Customizable thermal conductivity (≥2.0 W/(m·K) for high-demand scenarios), thermal resistance (≤0.10 K·m²/W for high-demand scenarios), foaming ratio and hardness, adapting to different heat-dissipation requirements, helping buyers optimize heat-dissipation effect.
Production Process
Thermal-conductive-oriented production process: High-purity thermal-conductive Silicone raw materials → formula optimization (add thermal-conductive fillers and heat-dissipation modifiers) → precision mixing → thermal conductivity test → heat dissipation test → standardized curing → thermal stability inspection → packaging. Strict thermal testing ensures product ultra-strong thermal conductivity and efficient heat dissipation.
FAQ
Q1: What is the thermal conductivity? A: ≥1.5 W/(m·K), low thermal resistance ≤0.15 K·m²/W, suitable for high-power heat-dissipation scenarios.
Q2: Can it effectively dissipate heat? A: Yes, heat dissipation efficiency ≥90%, effectively transferring heat, reducing equipment temperature, protecting electronic components.
Q3: Is it suitable for electronic products? A: Yes, paired with electronic potting compound, ideal for electronic heat-dissipation buffers and high-power equipment heat-dissipation parts.
Q4: Will high temperature affect its thermal conductivity? A: No, thermal stability ≥95%, thermal conductivity remains unchanged in -65℃-200℃, ensuring heat dissipation in high-temperature scenarios.
Shenzhen Hong Ye Jie Technology Co., Ltd
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