Product Overview
Our Electronic Potting Compound for Power Supplies, also called transparent electronic glue, transparent potting silicone or power encapsulation silicone, is a professional two-component liquid silicone tailored for power supply encapsulation, a key part of HONG YE SILICONE’s full silicone product matrix. Model HY-9320 is a transparent addition-curing silicone, designed to solve power supply encapsulation pain points—poor light transmission, high-temperature aging, environmental pollution and incomplete filling. It has good fluidity, cures deeply quickly, forming a high-elastic, transparent protective layer, ensuring clear observation of internal power components while providing comprehensive protection, far exceeding ordinary Electronic Potting Compound in power supply adaptability. Product Features & Advantages
1. Power supply-specific high transparency: 95% transmittance (450nm, 2mm) and refractive index 1.41, after encapsulation, internal power components are clearly visible, facilitating inspection and maintenance, avoiding hidden dangers of power failure.
2. Environmentally friendly addition-curing: Solvent-free addition-curing formula, no harmful emissions, pollution-free to the environment and operators, complying with global environmental protection requirements for power supply production.
3. Excellent temperature & UV resistance: Operates stably from -50℃ to 250℃, adapting to extreme working temperatures of power supplies; superior UV resistance, no yellowing or performance degradation after long-term use, extending power supply service life.
4. Good fluidity & easy operation: Low viscosity (500±100 mPa.s for both components), good fluidity, can fill tiny gaps of power supplies completely; 1:1 weight mixing ratio, easy to measure, suitable for automated power supply production lines.
5. High insulation & customization: Volume resistivity up to 1.0×10¹⁵ Ω·cm, ensuring safe operation of power supply circuits; hardness, viscosity and operation time can be customized to match different power supply sizes and encapsulation requirements.
Technical Specifications (Model HY-9320)
This product is a two-component transparent potting silicone for power supplies: Component A and B are both colorless transparent liquids, each with a viscosity of 500±100 mPa.s. The mixing ratio is 1:1 by weight. After curing, it reaches Shore A hardness 20±3, refractive index 1.41, transmittance 95% (450nm, 2mm), volume resistivity 1.0×10¹⁵ Ω·cm, and thermal expansion coefficient 280 ppm/℃. It is an addition-curing material, solvent-free, with wide temperature adaptability (-50℃ to 250℃) and excellent UV resistance. Other models and customizable parameters are available on request.
How to Use
1. Mixing: Pour Component A and B into a dry container, stir evenly, then stand to defoam or remove bubbles by vacuuming, ensuring no bubbles affect power supply encapsulation transparency and insulation.
2. Preparation of Components: Clean the power supply components to be encapsulated thoroughly, dry them (ensure dryness of internal chips if matching with LEDs), to avoid moisture affecting curing effect and power supply safety.
3. Potting: Pour the mixed silicone into the power supply shell, ensuring it fully infiltrates all components and fills all tiny gaps, guaranteeing comprehensive protection.
4. Curing: Place the encapsulated power supply into an oven for curing; the curing speed can be adjusted by changing the temperature, adapting to different power supply production rhythms.
Application Scenarios
Widely used for encapsulation of power supplies and related electronic components, including power安定器, power modules, high-power LED power supplies, patch LED encapsulation and lens filling. It is also an ideal encapsulation material for electronic components, circuit boards and other power-related products, applied in power electronics, LED lighting and electronic equipment industries. It ensures clear observation of internal power components, provides insulation, waterproofing and anti-aging protection, reduces power supply failure rates, and enhances product quality and market competitiveness for power supply manufacturers.
Certifications and Compliance
HONG YE SILICONE holds ISO9001 quality management system certification, CE and UL certifications. Our Electronic Potting Compound for Power Supplies (HY-9320) is an addition-curing, solvent-free product, fully complying with EU ROHS environmental directives and international power supply material standards, meeting the quality, environmental protection and safety requirements of global power supply markets, facilitating smooth import and reliable application in international power supply projects.
Customization Options
We provide professional OEM customization services focused on power supply encapsulation needs. According to customers’ power supply types (LED power supply, industrial power supply) and encapsulation requirements, we can customize key parameters such as cured hardness, viscosity, operation time and transmittance, optimizing adaptability to different power supply sizes and working environments, meeting personalized bulk procurement needs.
Production Process
The product undergoes strict multi-link quality control: high-quality transparent Silicone raw materials inspection → precise formula mixing (optimized for power supply high transmittance and insulation) → automated production and filling → pre-production sample transparency and performance testing → full inspection of finished products before shipment. Our professional QC team monitors the whole process, ensuring consistent transparency and protection performance of each batch for power supply encapsulation. FAQ
Q1: What packaging specifications are available? A1: Multiple specifications (5kg, 20kg, 25kg, 200kg) optional, suitable for small-batch power supply sample testing and large-batch mass production.
Q2: What is the shelf life and storage method? A2: 12-month shelf life; store in a cool, dry place, with Component A and B sealed separately; avoid contact with moisture after opening, unused glue must be recapped.
Q3: What substances should be avoided to prevent non-curing? A3: Avoid contact with oxygen, phosphorus, sulfur, acetylenic compounds, peroxides and metal compounds (lead, tin, cadmium), which may cause silicone non-curing.
Q4: Is it suitable for high-power LED power supply encapsulation? A4: Yes, it has 95% high transmittance and wide temperature adaptability (-50℃ to 250℃), adapting to high-power LED power supply working conditions, ensuring clear observation and stable operation.
Q5: Is it a hazardous material for transportation? A5: Non-hazardous, can be transported as general chemicals, complying with international transportation standards for power supply production materials.
Shenzhen Hong Ye Jie Technology Co., Ltd
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