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Home> Products> Electronic Potting Compound> Adhesion Enhanced Electronic Potting Silicone
Adhesion Enhanced Electronic Potting Silicone
Adhesion Enhanced Electronic Potting Silicone
Adhesion Enhanced Electronic Potting Silicone
Adhesion Enhanced Electronic Potting Silicone
Adhesion Enhanced Electronic Potting Silicone
Adhesion Enhanced Electronic Potting Silicone

Adhesion Enhanced Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-9040

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-5
Product Description
HONG YE SILICONE’s Adhesion Enhanced Electronic Potting Silicone is a professionalsecure attachment circuit protection material and upgraded grip improved module Potting Compound. It forms a durablestrong bond protective encapsulation layer for multi-substrate electronic modules. Featuring ultra-high adhesion stability and wide temperature resistance (-60℃ to 220℃), it complements our core product line: standard Electronic Potting Compound, heat-conductive Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
HY-SILICONE company

Product Overview

This two-component upgraded silicone potting material supports addition and condensation curing. Optimized with enhanced adhesion formula, it specializes in electronic component encapsulation, sealing and filling. It delivers exceptional gripping force and thermal stability on PCB, CPU, PC, PMMA and multiple metal substrates. It effectively absorbs thermal cycling stress, firmly locks chips and bonding wires, and avoids peeling or delamination caused by temperature changes and environmental erosion.

Technical Specifications

As a secure attachment circuit protection material, it features upgraded substrate affinity and ultra-strong bonding performance. It has low volatile content, high structural strength, and excellent resistance to ozone and chemical corrosion. It maintains stable insulation, heat dissipation and shockproof performance in extreme temperature cycles. Viscosity, curing hardness and operating time support full personalized industrial customization.
 
electronic silicone

Product Features & Advantages

1. Enhanced Bonding Performance: This grip improved module potting compound achieves tight adhesion with metals and plastic circuit substrates without degumming.
2. Durable Protective Layer: The formed strong bond protective encapsulation layer resists aging and peeling during long-term temperature cycling operation.
3. Full Environmental Resistance: Integrates waterproof, dustproof, anti-corrosion and wide-temperature resistant functions for all-round circuit protection.
4. Low-Volatility & High Stability: Purified formula reduces volatile precipitation, ensuring long-term stable operation of precision electronic equipment.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and thoroughly shake component B before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure optimal adhesion and curing effect.
3. Vacuum Defoaming: Defoam evenly mixed compound under 0.01MPa vacuum for 3 minutes for bubble-free encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Ideal for precision electronics, automotive circuit modules, outdoor sensing equipment and multi-material composite electronic devices. Its enhanced adhesion solves common degumming and peeling failures, improves product durability and yield, and cuts long-term equipment maintenance and replacement costs for manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic manufacturing safety and environmental specifications.

Customization Options

We support customized viscosity, curing hardness and operating time to adapt to different substrate materials and encapsulation processes.

Production Process

Adopting upgraded adhesion-enhanced formula and dust-free standardized production, each batch undergoes strict bonding and temperature cycle tests to guarantee stable quality.

FAQ

Q1: What is the core upgrade of this adhesion enhanced potting silicone?
A: It is a grip improved module potting compound with optimized formula, providing stronger and more durable
bonding force than ordinary potting silicone.
Q2: Will temperature cycling cause delamination of the encapsulation layer?
A: No. This secure attachment circuit protection material absorbs thermal stress effectively and maintains stable
bonding in long-term temperature alternation.
Q3: Is colloidal stratification normal after storage?
A: Yes. Even stirring before use will not affect its enhanced adhesion and comprehensive protective performance.
 
 
 
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