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Home> Products> Electronic Potting Compound> Low Permittivity Electronic Potting Silicone
Low Permittivity Electronic Potting Silicone
Low Permittivity Electronic Potting Silicone
Low Permittivity Electronic Potting Silicone
Low Permittivity Electronic Potting Silicone
Low Permittivity Electronic Potting Silicone
Low Permittivity Electronic Potting Silicone

Low Permittivity Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Product Attributes

Model No.: HY-9305

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic Potting Compound for General Encapsulation
Product Description
HONG YE SILICONE Low Permittivity Electronic Potting Silicone is a two-component addition-cure Electronic Potting Compound. This low dielectric constant encapsulating material ensures high frequency signal integrity and minimal polarization for sensitive radio frequency circuits. As a premium Silicone Encapsulant and Electronic Encapsulation Adhesive, it offers waterproof, insulation and thermal protection. Stable from -60℃ to 220℃, it bonds strongly to PCB, PC, PMMA and metals, shielding chips and bonding wires for high-speed electronic modules.
 
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Product Overview

Low Permittivity Electronic Potting Silicone is a liquid potting material. After mixing with curing agent, it cures into flexible elastomer to encapsulate, fill and seal electronic components. This Thermally Conductive Potting Compound preserves signal quality for high-frequency electronics, reducing signal distortion. It blocks moisture, dust and chemical corrosion, absorbs thermal cycling stress, and lowers failure rates for communication electronics manufacturers.

Product Features

  1. Low permittivity design, excellent for high frequency signal integrity, minimal polarization and low signal loss.
  2. Waterproof, dustproof, insulating, thermally conductive, shock resistant, ozone and chemical resistant.
  3. Wide operating temperature -60℃~220℃, absorbs thermal stress to protect chips and gold bonding wires.
  4. Low volatile content, high strength, reliable adhesion to aluminum, copper, stainless steel, PC, PMMA, PCB and CPU.
  5. Two-component addition cure system, supports room temperature or heat accelerated curing.

How To Use

  1. Fully stir component A to blend settled fillers, shake component B before mixing.
  2. Mix A and B strictly following the specified weight ratio.
  3. Vacuum defoam mixed compound under 0.01MPa for 3 minutes before pouring if needed.
  4. Pour the mixture and cure at room temperature or elevated temperature. Full curing takes 24 hours; temperature and humidity impact curing speed.
electronic silicone

Application Scenarios

This low dielectric constant encapsulating material is widely used for encapsulation, sealing and filling of high-frequency electronic components. It fits RF modules, high-speed PCB boards, LED and CPU assemblies. It helps electronics manufacturers maintain stable signal transmission, reduce product rework and extend service life.

Technical Specifications

This protective compound features low dielectric loss and stable electrical performance across temperature cycles. Hardness, viscosity and pot life can be customized based on client requirements.

Certifications and Compliance

Our electronic Potting Compound complies with RoHS and REACH standards, meeting global electronic industry requirements.

Customization Options

HONG YE SILICONE offers custom formulation for this Silicone Encapsulant. Adjust cured hardness, viscosity and operation time for your unique high-frequency electronic projects.

Production Process

Raw materials pass incoming inspection. Each batch undergoes mixing, vacuum processing and lab performance testing. Finished products get full quality inspection before packing to guarantee consistent batch quality.

FAQ

Q: What curing type is Low Permittivity Electronic Potting Silicone?
A: It is addition-cure silicone, which can cure at room temperature or with heating.
Q: Can leftover mixed glue be stored for later use?
A: Mixed compound must be used in one batch. Unmixed raw materials need sealed storage.
Q: What if material separation appears after long storage?
A: Stir thoroughly before use; its electrical and mechanical performance remains unchanged.
Q: Is this potting silicone hazardous?
A: It is non-hazardous. Avoid contact with eyes and mouth. Rinse thoroughly with clean water upon accidental contact.
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