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Home> Products> Electronic Potting Compound> Low Loss Electronic Potting Silicone
Low Loss Electronic Potting Silicone
Low Loss Electronic Potting Silicone
Low Loss Electronic Potting Silicone
Low Loss Electronic Potting Silicone
Low Loss Electronic Potting Silicone
Low Loss Electronic Potting Silicone

Low Loss Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9310

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
HONG YE SILICONE Low Loss Electronic Potting Silicone is a two-component addition-cure Electronic Potting Compound. This low dielectric loss encapsulating material delivers high frequency signal preservation and minimal attenuation for sensitive RF circuits. As a premium Silicone Encapsulant and Electronic Encapsulation Adhesive, it provides waterproof, insulation and thermal protection. Working steadily from -60℃ to 220℃, it adheres firmly to PCB, PC, PMMA and metals to protect chips and bonding wires for high-frequency electronic assemblies.
 
HY-silicone term

Product Overview

Low Loss Electronic Potting Silicone is pourable liquid potting material. Mixed with curing agent, it cures into flexible elastomer for encapsulation, filling and sealing electronic components. This Thermally Conductive Potting Compound keeps signal quality with minimal attenuation, cutting signal energy loss for high-frequency electronics. It resists moisture, dust and chemical corrosion, relieves thermal cycling stress and reduces failure rates for electronic manufacturers.

Product Features

  1. Low dielectric loss formula, great for high frequency signal preservation, minimal attenuation and low energy consumption.
  2. Waterproof, dustproof, insulating, thermally conductive, shock resistant, ozone and chemical corrosion resistant.
  3. Wide operating temperature range -60℃~220℃, absorbs thermal stress to protect chips and gold bonding wires.
  4. Low volatile content, high mechanical strength, good adhesion to aluminum, copper, stainless steel, PC, PMMA, PCB and CPU.
  5. Two-component addition cure system, supports room-temperature curing or heat accelerated curing.

How To Use

  1. Fully stir component A to homogenize settled fillers and shake component B before mixing.
  2. Mix A and B strictly according to the specified weight ratio.
  3. Vacuum defoam the mixed compound under 0.01MPa for 3 minutes before pouring if needed.
  4. Pour the mixture and cure at room temperature or elevated temperature. Full curing takes 24 hours; temperature and humidity affect curing speed.
electronic silicone

Application Scenarios

This minimal attenuation protective compound is used for encapsulation, sealing and filling of high-frequency electronic components. It works well for RF modules, high-speed PCB boards, LED and CPU assemblies. It helps manufacturers maintain stable high-frequency signal transmission, reduce rework rate and extend product service life.

Technical Specifications

This electronic Potting Compound features low dielectric loss and stable electrical performance over temperature cycles. Cured hardness, viscosity and pot life can be customized according to client requirements.

Certifications and Compliance

Our Silicone Encapsulant complies with RoHS and REACH standards, meeting global electronic industry requirements.

Customization Options

HONG YE SILICONE provides custom formulation for this low dielectric loss encapsulating material. Adjust cured hardness, viscosity and operation time for your high-frequency electronic projects.

Production Process

Raw materials pass incoming inspection. Each batch undergoes mixing, vacuum treatment and lab performance testing. Finished products get full quality inspection before packing to ensure consistent batch quality.

FAQ

Q: What curing type is Low Loss Electronic Potting Silicone?
A: It belongs to addition-cure silicone, curable at room temperature or by heating.
Q: Can leftover mixed glue be stored for later use?
A: Mixed compound must be used in one batch. Unmixed raw materials require sealed storage.
Q: What if material separation occurs after long storage?
A: Stir thoroughly before use; its electrical and mechanical performance remains unchanged.
Q: Is this potting silicone hazardous?
A: It is non-hazardous. Avoid contact with eyes and mouth. Rinse thoroughly with clean water
upon accidental contact.
 
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