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Home> Products> Electronic Potting Compound> Low Thermal Resistance Electronic Potting Silicone
Low Thermal Resistance Electronic Potting Silicone
Low Thermal Resistance Electronic Potting Silicone
Low Thermal Resistance Electronic Potting Silicone
Low Thermal Resistance Electronic Potting Silicone
Low Thermal Resistance Electronic Potting Silicone
Low Thermal Resistance Electronic Potting Silicone

Low Thermal Resistance Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9315

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
HONG YE SILICONE Low Thermal Resistance Electronic Potting Silicone is a two-component addition-cure low thermal resistance encapsulating material. As a premium Silicone Encapsulant and Thermally Conductive Potting Compound, it optimizes thermal path and boosts heat transfer efficiently. It delivers waterproof, insulation and shock protection, works steadily from -60℃ to 220℃. It bonds well to PCB, PC, PMMA and metals, relieves thermal cycling stress to protect chips and bonding wires for power electronics modules.
 
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Product Overview

Low Thermal Resistance Electronic Potting Silicone is a pourable liquid Electronic Potting Compound. Mixed with curing agent, it cures into flexible elastomer for encapsulation, sealing and filling electronic parts. This heat transfer efficient potting silicone minimizes thermal resistance, improving heat dissipation for power electronics. It provides moisture-proof, dust-proof and anti-corrosion protection, lowering thermal failure risk for electronic manufacturers.

Product Features

  1. Low thermal resistance formula optimizes thermal path, enabling efficient heat transfer for high-power assemblies.
  2. Waterproof, dustproof, insulating, shock resistant, ozone and chemical corrosion resistant.
  3. Wide working temperature range -60℃~220℃, absorbs thermal cycling stress to protect chips and gold bonding wires.
  4. Low volatile content, high mechanical strength, reliable adhesion to aluminum, copper, stainless steel, PC, PMMA, PCB and CPU.
  5. Two-component addition cure system, supports room-temperature curing or heat accelerated curing.

How To Use

  1. Fully stir component A to homogenize settled fillers and shake component B before mixing.
  2. Mix A and B strictly following the specified weight ratio.
  3. Vacuum defoam mixed compound under 0.01MPa for 3 minutes before pouring if required.
  4. Pour mixture and cure at room temperature or elevated temperature. Full curing takes 24h; temperature and humidity affect curing speed.
electronic silicone

Application Scenarios

This thermal path optimizing protective compound is used for encapsulation and sealing of power electronic components, LED drivers and CPU assemblies. It forms reliable heat transfer channels, stabilizes device operating temperature, reduces rework rate and extends service life of electronic products.

Technical Specifications

This Electronic Encapsulation Adhesive features low thermal resistance and stable thermal performance across temperature cycles. Cured hardness, viscosity and pot life can be customized to meet client project demands.

Certifications and Compliance

Our Silicone Encapsulant meets RoHS and REACH standards, satisfying global electronic industry environmental requirements.

Customization Options

HONG YE SILICONE provides custom formulation for this low thermal resistance encapsulating material. Adjust cured hardness, viscosity and operation time for your power electronics projects.

Production Process

Raw materials pass incoming inspection. Each batch undergoes mixing, vacuum treatment and lab performance testing. Finished products get full quality inspection before packing to ensure consistent batch quality.

FAQ

Q: What curing system does Low Thermal Resistance Electronic Potting Silicone adopt?
A: It belongs to addition-cure silicone, curable at room temperature or by heating.
Q: Can leftover mixed glue be stored for later use?
A: Mixed compound must be used in one batch. Unmixed raw materials need sealed storage.
Q: What should I do if material separation occurs after long storage?
A: Stir thoroughly before use; its thermal and mechanical performance remains unchanged.
Q: Is this potting silicone hazardous?
A: It is non-hazardous. Avoid contact with eyes and mouth. Rinse thoroughly with clean water upon accidental contact.
 
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