HONG YE SILICONE Non-Bleeding Electronic Potting Silicone is a two-component addition-cure Electronic Potting Compound. As a low bleed encapsulating material, it keeps assembly surfaces clean and contamination-free. This non-migrating potting silicone gel prevents oil and plasticizer migration, maintaining clean surface protective compound. It delivers waterproof, insulation and thermal protection, works steadily from -60℃ to 220℃, and bonds firmly to PCB, PC, PMMA and metals, ideal for clean electronic manufacturing.
Product Overview
Non-Bleeding Electronic Potting Silicone is a pourable liquid potting material. Mixed with curing agent, it cures into flexible elastomer for encapsulation, sealing and filling electronic components. This low bleed encapsulating material features excellent adhesion and thermal stability on PC, PMMA, PCB and CPU. It protects electronics against moisture, dust and corrosion while absorbing thermal cycling stress, keeping assemblies clean and reliable for sensitive electronic production lines.
Product Features
- Non-bleeding formula keeps substrate surfaces clean, prevents oil and plasticizer migration, ideal for clean surface protective compound applications.
- Waterproof, dustproof, insulating, thermally conductive, shock resistant, ozone and chemical corrosion resistant.
- Wide operating temperature range -60℃~220℃, absorbs thermal cycling stress to protect chips and gold bonding wires.
- Low volatile content, high mechanical strength, reliable adhesion to aluminum, copper, stainless steel, PC, PMMA, PCB and CPU.
- Two-component addition cure system, supports room-temperature or heat accelerated curing.
How To Use
- Fully stir component A to homogenize settled fillers and shake component B before mixing.
- Mix A and B strictly following the specified weight ratio.
- Vacuum defoam the mixed compound under 0.01MPa for 3 minutes before pouring if required.
- Pour the mixture and cure at room temperature or elevated temperature. Full curing takes 24 hours; temperature and humidity affect curing speed.
Application Scenarios
This non-migrating potting silicone gel is widely used for encapsulation, sealing and filling of electronic components in LED modules, PCB boards and CPU assemblies. It keeps finished devices free from oily residues, improving product appearance and reducing cleaning cost for manufacturers. It also helps stabilize device performance in sensitive electronics applications.
Technical Specifications
This Silicone Encapsulant features low bleed-out and stable mechanical performance across temperature cycles. Cured hardness, viscosity and pot life can be customized to meet client project requirements. Certifications and Compliance
Customization Options
HONG YE SILICONE provides custom formulation for this low bleed encapsulating material. Adjust cured hardness, viscosity and operation time for your clean electronic manufacturing projects.
Production Process
Raw materials pass incoming inspection. Each batch undergoes mixing, vacuum treatment and lab performance testing. Finished products get full quality inspection before packing to ensure consistent batch quality.
FAQ
Q: What curing type does Non-Bleeding Electronic Potting Silicone adopt?
A: It is addition-cure silicone, curable at room temperature or by heating.
Q: Why does this potting silicone keep surfaces clean?
A: Its low bleed formula prevents oil and plasticizer migration, so cured parts stay contamination-free.
Q: Can leftover mixed glue be stored for later use?
A: Mixed compound must be used in one batch. Unmixed raw materials need sealed storage.
Q: Is this potting silicone hazardous?
A: It is non-hazardous. Avoid contact with eyes and mouth. Rinse thoroughly with clean water upon
accidental contact.