Battery Pack Encapsulation Compound

Elemental Electronic Encapsulation Compound

  HONG YE SILICONE’s Elemental Electronic Encapsulation Compound is a reliable foundational board sealing resin, practical primary circuit protective layer and essential basic module waterproofing agent. Tailored for fundamental electronic...

Elite Electronic Encapsulation Compound

HONG YE SILICONE’s Elite Electronic Encapsulation Compound is a premium superior dielectric barrier adhesive, professional advanced thermal management filler and durable rugged environmental shielding gel. Built for high-end precision electronics,...

Battery Module Electronic Potting Compound

HONG YE SILICONE Battery Module Electronic Potting Silicone Compound (Model HY-9055) is a high-performance two-component low-viscosity silicone, specially engineered for battery module protection. Mixed at 1:1 weight ratio, it cures deeply and...

Electronic Potting Compound for General Encapsulation

HONG YE SILICONE’s Electronic Potting Compound for General Encapsulation is a versatile versatile protective covering material and cost-effective standard grade module potting compound. As premium reliable circuit board sealing silicone, it delivers...

Electronic Potting Compound for Battery Management Systems

HONG YE SILICONE Electronic Potting Compound is a professional two-component Addition curing silicone designed for Battery Management Systems (BMS). Also called Silicone Potting Compound or Electronic Encapsulation Adhesive, it features excellent...

Transformer and Power Supply Encapsulation

10~12USD

Product Description Hong Ye Silicone HY-9 Series is a two-component addition-cure potting compound engineered for transformer encapsulation, power supply module protection and industrial electronics sealing. Its low viscosity and self-adhesive...

Reliable Encapsulation Material for Electronics

HONG YE SILICONE Silicone Potting Compound (Electronic Encapsulation Adhesive) is a premium liquid silicone material with integrated waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. Mixed with a curing...

Durable Electronic Encapsulation Material

HONG YE SILICONE Silicone Potting Compound (Electronic Encapsulation Adhesive) is a high-grade liquid silicone material with integrated waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. It cures into a solid...

Electronics Encapsulation Sealing Insulation

HONGYE SILICONE’s Electronics Encapsulation Sealing Insulation silicone is a premium dual-component addition curing product, tailored for global B2B purchasers in electronic components, automotive electronics, industrial control, and precision...

High-Viscosity Easy-Pour Electronic Encapsulation Silicone

HONG YE low-viscosity Silicone Encapsulant is a professional Addition curing silicone and Potting Compound tailored for precision encapsulation. As high-quality Liquid Tank Sealant and Filter Potting Silicone, this RTV 2 Silicone Rubber features...

PCB Board Sealing and Encapsulation

Product DescriptionHong Ye Silicone HY-9 Series Electronic Potting Silicone is a two-component addition-cure (platinum-cure) silicone gel designed for electronic potting, sealing, encapsulation and protection. It cures at room temperature or with...

Classic Electronic Potting Compound

HONG YE SILICONE’s Classic Electronic Potting Compound is a mature time tested protective encapsulation material and reliable proven module potting compound. With long-term market verification, this Classic Electronic Potting Compound Proven...