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Home> Products> Electronic Potting Compound> Smooth Flow Electronic Potting Compound
Smooth Flow Electronic Potting Compound
Smooth Flow Electronic Potting Compound
Smooth Flow Electronic Potting Compound
Smooth Flow Electronic Potting Compound
Smooth Flow Electronic Potting Compound
Smooth Flow Electronic Potting Compound

Smooth Flow Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9035

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-4
Product Description
HONG YE SILICONE’s Smooth Flow Electronic Potting Compound is a high-fluidity easy dispensing protective encapsulation material and consistent pour module Potting Compound. Featuring excellent defoaming performance, it is a professionalair release circuit protection silicone for intricate electronic modules. It works stably at -60℃ to 220℃ with full insulation and heat dissipation. We also supply classicElectronic potting compound, high-performance Thermally Conductive Potting Compound, versatile Electronic Encapsulation Adhesive and durable Silicone Encapsulant for diverse packaging solutions.
 
package2

Product Overview

This two-component smooth flow silicone potting material includes addition and condensation curing types. It features ultra-stable fluidity and consistent pouring performance, solving filling dead zones of complex and tiny electronic structures. Ideal for encapsulation, sealing and gap filling, it delivers excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates. It effectively absorbs internal thermal cycling stress to protect chips and bonding wires, with low volatility and high overall structural stability.

Technical Specifications

This air release circuit protection silicone boasts self-defoaming property and smooth flowing features for bubble-free encapsulation. It has low volatile content, high bonding strength and outstanding resistance to ozone and chemical erosion. It maintains stable insulation, shockproof and heat-dissipating performance in wide temperature ranges. Viscosity, operating time and curing hardness support full personalized customization for automated production.
 
electronic silicone

Product Features & Advantages

1. Excellent Fluidity: As an easy dispensing protective encapsulation material, it flows freely into tiny gaps for full coverage encapsulation.
2. Consistent Pouring Performance: This consistent pour module potting compound ensures uniform filling without material accumulation or missing gaps.
3. Superior Air Release Ability: Effectively eliminates internal bubbles to avoid hollow encapsulation and ensure stable circuit protection.
4. All-Round Environmental Resistance: Integrates waterproof, dustproof, anti-corrosion and extreme temperature resistant functions for long-term stable operation.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to disperse settled fillers evenly and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure stable fluidity and curing effect.
3. Vacuum Defoaming: Defoam mixed compound under 0.01MPa vacuum for 3 minutes to achieve flawless bubble-free pouring.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Perfect for intricate electronic modules, miniature circuit boards, dense component equipment and automated batch production. Its smooth flow and air release features improve encapsulation yield, reduce bubble defect rates, save labor and material costs, and greatly enhance production efficiency for electronic manufacturers.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global electronic manufacturing safety and environmental requirements.

Customization Options

We support customized viscosity, curing hardness and operating time to adapt to different automated dispensing and encapsulation processes.

Production Process

Adopting high-purity fluidized raw materials and standardized production, each batch undergoes strict fluidity and defoaming tests to ensure consistent pouring performance.

FAQ

Q1: What is the core advantage of this smooth flow potting compound?
A: It is an easy dispensing protective encapsulation material with great air release capacity, perfectly
suited for complex tiny electronic structures.
Q2: Can it realize fully bubble-free encapsulation?
A: Yes. With professional vacuum defoaming treatment and its own air release performance, it achieves
high-quality seamless encapsulation.
Q3: Will colloidal stratification affect fluidity performance?
A: No. Stir evenly before use, and it can restore stable smooth flow and consistent pouring performance
completely.
 
 
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