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Home> Products> Electronic Potting Compound> High Modulus Electronic Potting Compound
High Modulus Electronic Potting Compound
High Modulus Electronic Potting Compound
High Modulus Electronic Potting Compound
High Modulus Electronic Potting Compound
High Modulus Electronic Potting Compound
High Modulus Electronic Potting Compound

High Modulus Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9030

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Low Viscosity Electronic Potting Liquid Silicone
Product Description
HONG YE SILICONE’s High Modulus Electronic Potting Compound is a high-strength high stiffness protective encapsulant material and rigid structural potting silicone compound. This dimensionally stable electronic sealant resin delivers excellent structural reinforcement and long-term shape stability. It supports addition and condensation curing, with a -60℃ to 220℃ operating range. It enriches our full product line including standard Electronic Potting Compound, heat-efficient Thermally Conductive Potting Compound, bonding Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
electronic silicone

Product Overview

This two-component high modulus potting silicone cures rapidly after mixing with curing agents to form rigid, high-stiffness protective layers. It is dedicated to electronic component encapsulation, sealing, filling and pressure resistance. It boasts outstanding adhesion and thermal stability on PCB, CPU, PC and PMMA substrates, as well as aluminum, copper and stainless steel. It integrates waterproof, flame-retardant, insulating and shockproof functions, ideal for electronics requiring strict structural stability.

Technical Specifications

Featuring high modulus and high structural stiffness, this dimensionally stable electronic sealant resin minimizes deformation under thermal cycling and mechanical stress. It resists ozone, chemical erosion and corrosion effectively. It absorbs internal thermal stress to protect chips and gold bonding wires. With low volatile content and high mechanical strength, it ensures tight and stable long-term sealing. Hardness, viscosity and operating time can be fully customized for industrial demands.
 
HY-factory

Product Features & Advantages

1. Superior Structural Stability: This high stiffness protective encapsulant material provides rigid support, effectively preventing electronic module deformation and displacement.
2. Extreme Temperature Resistance: Stable physical and insulating performance from -60℃ to 220℃ adapts to harsh temperature cycling environments.
3. Multi-Dimensional Protection: Integrates dustproof, waterproof, anti-corrosion and shockproof performance to extend electronic service life.
4. High Purity & Strong Adhesion: Low volatile content avoids circuit contamination, while excellent multi-substrate bonding ensures durable sealing performance.

Step-by-Step Application Process

1. Pre-Stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure uniform rigid curing effect.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes defoaming for bubble-free pouring.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, greatly affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Perfect for high-stability LED modules, precision industrial control boards and pressure-resistant electronic components. This rigid structural potting silicone compound stabilizes product structure, reduces deformation failure rates, lowers long-term maintenance costs, and improves product reliability and market competitiveness.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global precision electronic manufacturing specifications.

Customization Options

Customizable curing hardness, colloid viscosity and operating time are available to match personalized high-stability encapsulation requirements.

Production Process

Adopting standardized dust-free production and strict batch stiffness & dimensional stability testing, every batch of dimensionally stable electronic sealant resin undergoes full inspection to guarantee consistent high-grade quality.

FAQ

Q1: What is the core advantage of high modulus potting compound?
A: It features high stiffness and excellent dimensional stability, providing rigid structural reinforcement
unavailable from ordinary flexible potting silicone.
Q2: Can stratified colloid after storage be used normally?
A: Yes. Even stirring before use can fully restore original structural protection performance without quality loss.
Q3: What safety and storage tips should be noted?
A: The product is non-hazardous. Store airtightly and use mixed glue at one time. Avoid eye and
mouth contact; rinse with clean water immediately if accidental contact occurs.
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