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Home> Products> Electronic Potting Compound> High Thermal Stability Electronic Potting Silicone
High Thermal Stability Electronic Potting Silicone
High Thermal Stability Electronic Potting Silicone
High Thermal Stability Electronic Potting Silicone
High Thermal Stability Electronic Potting Silicone
High Thermal Stability Electronic Potting Silicone
High Thermal Stability Electronic Potting Silicone

High Thermal Stability Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Product Attributes

Model No.: HY-9055

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Low Viscosity Electronic Potting Liquid Silicone
Product Description
HONG YE SILICONE High Thermal Stability Electronic Potting Silicone is a two-component addition cure Electronic Potting Compound, also known as Silicone Encapsulant and Thermally Conductive Potting Compound. This high temperature resistant encapsulating material provides reliable waterproof, moisture-proof, insulation and shock protection for electronic parts. It works steadily from -60℃ to 220℃, relieving thermal cycling stress for chips and gold wires. It adheres well to PCB, PC, PMMA, CPU and multiple metals, ideal for LED and power electronics encapsulation.
 
HY-silicone term

Product Overview

High Thermal Stability Electronic Potting Silicone is a heat resistant electronic protective resin for electronic encapsulation. After mixing with curing agent, liquid silicone cures into solid elastomer to seal, fill and protect electronic components. As one of our core silicone materials, this thermal stability potting silicone compound delivers outstanding thermal stability, corrosion resistance and electrical insulation. It protects sensitive electronics against moisture, dust, vibration and chemical erosion, lowering product failure rate for manufacturers.

Product Features

  1. Wide working temperature range from -60℃ to 220℃, absorbs thermal cycling stress to safeguard chips and bonding gold wires.
  2. Waterproof, dustproof, shockproof, insulating and thermally conductive; good ozone and chemical resistance.
  3. Low volatile content, high strength and strong adhesion on aluminum, copper, stainless steel, PC, PMMA, PCB and CPU.
  4. Available as addition-cure silicone, room-temperature or heat accelerated curing.
electronic silicone

How To Use

  1. Stir component A thoroughly to re-mix settled fillers, shake component B well before mixing.
  2. Mix A and B strictly following the designated weight ratio.
  3. Vacuum defoam mixed compound at 0.01MPa for 3 minutes before pouring if needed.
  4. Cure at room or elevated temperature. Full curing takes 24 hours; temperature and humidity impact curing speed.

Application Scenarios

This Silicone Encapsulant is widely used for encapsulation, sealing and filling of electronic components. It suits LED modules, PCB boards, CPU and power units. It provides pressure resistance and stable sealing performance for devices exposed to frequent temperature changes. The Thermally Conductive Potting Compound keeps electronic assemblies stable under harsh thermal environments, extending service life and reducing maintenance cost.

Technical Specifications

This high temperature resistant encapsulating material features low volatile content and stable mechanical strength. Its bonding performance maintains consistency under repeated hot and cold cycles. Hardness, viscosity and pot life can be adjusted to meet custom requirements.

Customization Options

HONG YE SILICONE supports custom formulation for this thermal stability potting silicone compound. You can adjust cured hardness, viscosity and operation time according to your project requirements.

Certifications and Compliance

Our electronic potting compound meets mainstream international material standards, complying with RoHS and REACH requirements for global electronic supply chain.

FAQ

Q: What curing type is this High Thermal Stability Electronic Potting Silicone?
A: It is addition cured silicone, can cure at room temperature or with heating.
 
Q: Can leftover mixed glue be stored for later use?
A: Mixed compound should be used up in one batch. Unmixed raw material needs sealed storage.
 
Q: Is it dangerous goods?
A: Non-hazardous. Avoid contact with eyes and mouth. Rinse with clean water once contacted.
 
Q: Layer separation occurs after long storage, is it still usable?
A: Stir evenly before use, product performance remains unchanged.
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