Ms. zhou

What can I do for you?

Ms. zhou

What can I do for you?

Home> Products> Electronic Potting Compound> Low Compression Set Electronic Potting Silicone
Low Compression Set Electronic Potting Silicone
Low Compression Set Electronic Potting Silicone
Low Compression Set Electronic Potting Silicone
Low Compression Set Electronic Potting Silicone
Low Compression Set Electronic Potting Silicone
Low Compression Set Electronic Potting Silicone

Low Compression Set Electronic Potting Silicone

Get Latest Price
Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.: HY-9015

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
Picture Example :

The file is encrypted. Please fill in the following information to continue accessing it

Low Viscosity Electronic Potting Liquid Silicone
Product Description
HONG YE SILICONE Low Compression Set Electronic Potting Silicone is a two-component addition cure Electronic Potting Compound. This dimensionally stable potting silicone gel features minimal permanent deformation under pressure, delivering long term sealing protection. As a reliable Silicone Encapsulant and Thermally Conductive Potting Compound, it offers waterproof, insulation and shock resistance. It works steadily from -60℃ to 220℃, protects chips and bonding wires, and bonds excellently to PCB, PC, PMMA, CPU and metals for LED and power electronics encapsulation.
 
HY-factory

Product Overview

Low Compression Set Electronic Potting Silicone belongs to Electronic Encapsulation Adhesive. After mixing with curing agent, the liquid compound cures into elastomer to seal, fill and cushion electronic components. This low compression set encapsulating material retains its original shape after compression load release, maintaining stable sealing performance for long service cycles. It prevents moisture, dust, chemical corrosion and thermal cycling stress, reducing electronic product failure rate for manufacturers.

Product Features

  1. Ultra low compression set, outstanding dimensional stability, maintains consistent sealing after repeated compression.
  2. Waterproof, dustproof, insulating, thermally conductive, shockproof, ozone and chemical resistant.
  3. Wide temperature range -60℃~220℃, absorbs thermal cycling stress to protect chips and gold bonding wires.
  4. Low volatile content, high mechanical strength, strong adhesion to aluminum, copper, stainless steel, PC, PMMA, PCB and CPU.
  5. Two-component addition cure system, available for room temperature or heat accelerated curing.

How To Use

  1. Fully stir component A to reblend settled fillers and shake component B before mixing.
  2. Mix A and B strictly following the specified weight ratio.
  3. Vacuum defoam the mixture under 0.01MPa for 3 minutes before pouring if required.
  4. Pour the mixture and cure at room temperature or elevated temperature. Full curing takes 24 hours; temperature and humidity affect curing speed.
electronic silicone

Application Scenarios

This long term sealing protective compound is widely used for encapsulation, sealing and pressure-proof filling of electronic components. It is ideal for LED modules, PCB boards, CPU and power units exposed to cyclic pressure and temperature shifts. It helps manufacturers cut after-sales failure and extend product lifespan.

Technical Specifications

This dimensionally stable potting silicone gel features low volatile content and stable mechanical performance. Its compression recovery remains consistent after repeated hot-cold cycles. Hardness, viscosity and pot life can be adjusted on request.

Certifications and Compliance

Our electronic Potting Compound meets RoHS and REACH standards, complying with global electronic supply chain requirements.

Customization Options

HONG YE SILICONE supports custom formulation for this low compression set encapsulating material. Adjust cured hardness, viscosity and operation time according to your project specifications.

Production Process

Raw materials are inspected before feeding. Each batch undergoes mixing, vacuum treatment and lab performance testing. Finished goods pass quality inspection before packing to guarantee stable batch quality.

FAQ

Q: What curing type is Low Compression Set Electronic Potting Silicone?
A: It is addition-cure silicone, curing at room temperature or with heating.
Q: Can leftover mixed glue be stored?
A: Mixed compound must be used up in one batch. Unmixed raw materials need sealed storage.
Q: What if material separation appears after long storage?
A: Stir thoroughly before use, product performance stays unchanged.
Q: Is this product hazardous?
A: It is non-hazardous. Avoid eye and mouth contact. Rinse with clean water once contacted.
Home> Products> Electronic Potting Compound> Low Compression Set Electronic Potting Silicone
  • Send Inquiry

Copyright © 2026 Shenzhen Hong Ye Jie Technology Co., Ltd All rights reserved. Privacy Policy

Send Inquiry
*
*

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

Send