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Home> Products> Electronic Potting Compound> Low Dielectric Constant Electronic Potting Silicone
Low Dielectric Constant Electronic Potting Silicone
Low Dielectric Constant Electronic Potting Silicone
Low Dielectric Constant Electronic Potting Silicone
Low Dielectric Constant Electronic Potting Silicone
Low Dielectric Constant Electronic Potting Silicone
Low Dielectric Constant Electronic Potting Silicone

Low Dielectric Constant Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-9045

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-6
Product Description
 
HONG YE SILICONE Low Dielectric Constant Electronic Potting Silicone is a two-component addition-cured Silicone Encapsulant, also known as low permittivity encapsulating material. This high frequency compatible Potting Compound preserves signal integrity for high-frequency electronics. It functions as Electronic Potting Compound and Silicone Encapsulant, delivering waterproof, moisture-proof, insulation and thermal protection. It adheres excellently to PCB, PC, PMMA and CPU, absorbs thermal cycling stress, and works steadily from -60℃ to 220℃. Custom hardness, viscosity and pot life are available.
 
HY-SILICONE company

Product Overview

Low Dielectric Constant Electronic Potting Silicone is a premium Electronic potting compound and Silicone Encapsulant from HONG YE SILICONE. This low permittivity encapsulating material is a two-part liquid silicone potting material. After mixing with curing agent, it cures into solid elastomer to fully encapsulate and safeguard electronic components. As a high frequency compatible potting compound, it maintains excellent signal integrity for high-frequency circuits. It provides waterproof, moisture-proof, dustproof, insulating and shock-resistant protection, with stable thermal performance. It bonds tightly with PC, PMMA, PCB and CPU substrates, relieves thermal stress inside packaged chips and gold wires.

Product Features

This Thermally Conductive Potting Compound has outstanding anti-corrosion, waterproof, insulation and shock absorption performance. It owns great ozone resistance and chemical resistance, operating continuously from -60℃ to 220℃. Low volatile content, high strength and reliable adhesion to aluminum, copper and stainless steel metals. The core advantage of this low dielectric silicone is stable low permittivity, minimizing signal loss for high-frequency devices. It includes two curing types: addition cure and condensation cure electronic potting silicone.
 
electronic silicone

Application Scenarios

This Silicone Encapsulant is used for encapsulation, sealing, filling and pressure resistance protection of electronic components. It suits high-frequency PCB, CPU, LED modules and sensitive electronic assemblies. It offers reliable sealing and thermal stability for PC, PMMA, circuit boards. Buyers can reduce field failure rates, extend device service life and improve signal stability by adopting this high frequency compatible potting compound.

How To Use

  1. Fully stir component A to redistribute settled fillers and shake component B well before mixing.
  2. Mix A and B strictly according to specified weight ratio.
  3. Vacuum defoam blended compound at 0.01MPa for 3 minutes before pouring.
  4. It is addition-cure silicone. Cure at room temperature or elevated temperature. Initial cure allows next processing, full cure takes 24h. Ambient temperature and humidity affect curing speed.

Customization Options

HONG YE SILICONE supports custom parameters for this low permittivity encapsulating material. Hardness, viscosity and working time can be adjusted to satisfy unique project requirements.

Certifications and Compliance

Our Electronic potting compound complies with mainstream international electronics standards, meets RoHS and REACH requirements, and supports TDS, MSDS and COA documents for customer qualification audit.

FAQ

Q: Is the mixed potting compound reusable?
A: No. Once A and B are mixed, use up all material in one batch, leftover mixture cannot be stored.
Q: What if the liquid separates after long storage?
A: Slight separation is normal. Stir thoroughly before use and the performance remains unchanged.
Q: Safety handling tips?
A: Seal storage. Non-hazardous material, avoid eye and mouth contact. Rinse with clean water
once contact happens.
 
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