Ms. zhou

What can I do for you?

Communicate
Ms. zhou

Ms. zhou

What can I do for you?

+86 18938861889
Contact now
  • All
  • Products

Select Language

Shenzhen Hong Ye Jie Technology Co., Ltd

English

Home> Products> Electronic Potting Compound> Low Hardness Electronic Potting Silicone
Low Hardness Electronic Potting Silicone
Low Hardness Electronic Potting Silicone
Low Hardness Electronic Potting Silicone
Low Hardness Electronic Potting Silicone
Low Hardness Electronic Potting Silicone
Low Hardness Electronic Potting Silicone

Low Hardness Electronic Potting Silicone

Get Latest Price
Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Contact Now
Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9035

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
Picture Example :

The file is encrypted. Please fill in the following information to continue accessing it

Inquire the password
Electronic Potting Compound for General Encapsulation
Product Description
HONG YE SILICONE’s Low Hardness Electronic Potting Silicone is a premium soft flexible encapsulating silicone gel and professional ultra low durometer Potting Compound, customized as a reliable delicate component protective sealant. Featuring ultra-soft cured texture, it effectively releases thermal stress to protect fragile electronic parts. It supports addition and condensation curing, with a stable working range of -60℃ to 220℃. It supplements our full product series including standardElectronic Potting Compound, heat-efficient Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and industrial Silicone Encapsulant.
 
package4

Product Overview

This two-component low-hardness silicone gel cures gently after mixing with curing agents, forming a soft, elastic protective layer for precision electronic components. It undertakes multi-functional encapsulation, sealing, filling and pressure buffering tasks. It delivers excellent waterproof, insulating, heat-dissipating and shockproof performance, with superior adhesion and thermal stability on PCB, CPU, PC, PMMA and various metal substrates. Different from rigid potting materials, its ultra-soft property avoids extrusion damage to delicate chips and bonding wires.

Technical Specifications

This ultra low durometer potting compound features low hardness and high flexibility after curing. It resists ozone erosion, chemical corrosion and aging effectively. It efficiently absorbs internal thermal cycling stress, protecting delicate components and gold bonding wires from fatigue damage. With low volatile content and mild bonding strength, it fits fragile precision electronics perfectly. Curing hardness, viscosity and operating time can be fully customized for precision manufacturing needs.
 
electronic silicone

Product Features & Advantages

1. Ultra-Soft Protective Performance: This soft flexible encapsulating silicone gel produces no extrusion pressure, being the ideal delicate component protective sealant for fragile precision electronics.
2. Excellent Stress Relief Capacity: Flexible elastic structure buffers thermal expansion and contraction stress, preventing component cracking and damage during long-term temperature cycling.
3. Full Environmental Resistance: Integrates waterproof, moisture-proof, dustproof, insulating and anti-corrosion functions to adapt to complex working environments.
4. High Purity & Wide Compatibility: Low volatile content ensures clean circuit operation, with stable adhesion on plastics and metal materials without damaging precision parts.

Step-by-Step Application Process

1. Pre-Stirring: Fully stir component A evenly to disperse settled fillers completely and shake component B thoroughly before mixing.
2. Precise Proportioning: Mix A and B components strictly in standard weight ratio to ensure uniform soft curing effect.
3. Vacuum Defoaming: After uniform stirring, defoam the mixed colloid at 0.01MPa for 3 minutes to eliminate tiny bubbles.
4. Standard Curing: Support room-temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Specially designed for precision LED devices, fragile sensor components and high-precision circuit modules. This low-hardness potting silicone avoids component damage caused by rigid extrusion, reduces precision product failure rates, lowers after-sales maintenance costs, and improves the yield and reliability of high-end electronic products.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS international standards, meeting global precision electronic manufacturing safety and environmental specifications.

Customization Options

Customizable cured hardness, colloid viscosity and operating pot life are available to meet personalized precision encapsulation demands.

Production Process

Adopting dust-free refined production and strict batch flexibility & hardness testing, every batch of soft flexible encapsulating silicone gel undergoes full inspection to ensure stable precision protection performance.

FAQ

Q1: What is the core advantage of low hardness potting silicone?
A: It features ultra-low hardness and high flexibility, relieving thermal stress without squeezing
fragile components, which is irreplaceable for precision electronics compared with ordinary
rigid Silicone Encapsulant.
Q2: Is stratified colloid after storage usable?
A: Yes. Even stirring before use can fully restore original soft protection performance with
no quality degradation.
Q3: What are the daily operation and storage notes?
A: The product is non-hazardous. Keep sealed storage and use mixed glue at one time.
Avoid ingestion and eye contact, and rinse with clean water immediately if contacted accidentally.
 
 
Hot Products
Silicone Rubber for soft robotics
Silicone Rubber for soft robotics

Contact Now
Resin Sculpture Mold with Silicone Rubber
Resin Sculpture Mold with Silicone Rubber

Contact Now
Condensation Curing Silicone Mold for Gypsum Cornice
Condensation Curing Silicone Mold for Gypsum Cornice

Contact Now
High Quality Human Body Silicone
High Quality Human Body Silicone

Contact Now
Human Body Silicone for Life Casting Applications
Human Body Silicone for Life Casting Applications

Contact Now
Pad Printing Silicone for Children Toy
Pad Printing Silicone for Children Toy

Contact Now
Durable Electronic Encapsulation Material
Durable Electronic Encapsulation Material

Contact Now
Flexible Silicone for Pad Printing Solutions
Flexible Silicone for Pad Printing Solutions

Contact Now
High Quality Silicone Rubber for Transfer Printing
High Quality Silicone Rubber for Transfer Printing

Contact Now
Liquid Sealant Silicone for Air Purification Systems
Liquid Sealant Silicone for Air Purification Systems

Contact Now
Home> Products> Electronic Potting Compound> Low Hardness Electronic Potting Silicone
Contact Us
zhou

Ms. zhou

Leave a message
Contact Now
Recommend
Contact Now
  • Send Inquiry

Copyright © 2026 Shenzhen Hong Ye Jie Technology Co., Ltd All rights reserved. Privacy Policy

Send Inquiry
*
*

Send Message

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

We will contact you immediately

Fill in more information so that we can get in touch with you faster

Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.

Upload Attachment
Send