HONG YE SILICONE High Volume Resistivity Electronic Potting Silicone is a two-component addition cure Silicone Encapsulant, also known as Electronic Potting Compound, silicone encapsulation adhesive. It delivers superior volume resistivity and excellent dielectric strength, with waterproof, moisture-proof, thermal conductive and flame retardant properties. After mixing with curing agent, liquid silicone cures to form a protective layer, shielding electronic components from harsh operating conditions.This high insulation resistance potting gel serves as a superior volume resistivity protective compound. It bonds firmly to PC, PMMA, PCB and CPU substrates, offering reliable sealing and thermal stability for LED and electronic assemblies.
Product Features
This silicone encapsulant has outstanding anti-corrosion, dustproof, shock resistance and thermal dissipation performance. It features great ozone resistance and chemical erosion resistance. The cured material works continuously from -60℃ to 220℃, absorbing thermal cycling stress to safeguard chips and bonding gold wires. Low volatile content, high strength and strong adhesion to aluminum, copper and stainless steel.
Application Scenarios
Our Thermally Conductive Potting Compound is widely used for encapsulation, sealing, filling and pressure protection of electronic components. It fits LED modules, PCB boards and CPU units. It maintains stable sealing performance on PC insulation board, PMMA acrylic and various metal substrates, extending component service life and cutting maintenance cost for manufacturers.
How To Use
- Fully stir component A to redistribute settled fillers and shake component B well before mixing.
- Mix A and B strictly following required weight ratio.
- Vacuum defoaming is optional. Place mixed silicone under 0.01MPa vacuum for 3 minutes before pouring.
- It is Addition Curing Silicone. Cure at room temperature or elevated temperature. Partial cure allows next operation, full cure takes 24h. Ambient temperature and humidity affect curing speed.
Technical Specifications
Two-component addition cure silicone encapsulant. Wide working temperature range -60℃ ~ 220℃. Low volatile matter, strong substrate adhesion. High volume resistivity, excellent dielectric strength. Adjustable hardness, viscosity and working time upon request.
Certifications and Compliance
HONG YE SILICONE strictly controls raw material and production quality. Our silicone encapsulant complies with relevant electronic material standards, supporting international projects with stable and consistent material performance.
Customization Options
We provide custom service for this superior volume resistivity protective compound. Adjust cured hardness, viscosity and pot life according to your project requirements.
Production Process
Raw silicone materials go through inspection, compounding, stirring, filtration and quality testing before packaging. Strict in-line QC ensures batch consistency for every electronic Potting Compound shipment. FAQ
Q1: What if separation appears after long storage?
A: Slight layer separation is normal. Stir thoroughly before use and performance remains unchanged.
Q2: Is the high insulation resistance potting gel hazardous?
A: Non-hazardous goods, avoid contact with eyes and mouth. Rinse with clean water once contacted.
Q3: Can leftover mixed glue be stored?
: Mixed silicone must be used up in one time, leftover cannot be stored.