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Electronic Potting Compound
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9320Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/20kg/25kg/200kgSupply Ability:100TONHONG YE SILICONE High Transparency Electronic Potting Silicone is a premium two-component addition curing silicone, also known as transparent electronic glue or LED encapsulation silicone. Featuring 95% high light transmittance, excellent UV aging...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9025Packaging:1kg/5kg/20kg/25kg/200kgSupply Ability:100TONHONG YE SILICONE Silicone Potting Compound (Electronic Encapsulation Adhesive) is a high-grade liquid silicone material with integrated waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. It cures into a solid...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9040Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/20kg/25kg/200kgSupply Ability:100TONHONG YE SILICONE Silicone Potting Compound (Electronic Encapsulation Adhesive) is a premium liquid silicone material integrating waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. Mixed with a curing agent, it...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9035Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/20kg/25kg/200kgSupply Ability:100TONHONG YE SILICONE Silicone Potting Compound, also called Electronic Encapsulation Adhesive, is a high-grade liquid silicone material integrating waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. Mixed with a...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9030Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/20kg/25kg/200kgSupply Ability:100TONHONG YE SILICONE Silicone Potting Compound (Electronic Encapsulation Adhesive) is a premium liquid silicone material with integrated waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. Mixed with a curing...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9020Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/20kg/25/kg/200kgSupply Ability:100TONHONG YE SILICONE Electronic Potting Compound, also called Silicone Encapsulant, is a premium liquid silicone material with waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. It cures solid after mixing with a...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9015Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/20kg/25kg/200kgSupply Ability:100TONHONG YE SILICONE's Electronic Potting Compound, also known as silicone encapsulant, is a highquality potting material with waterproof, moistureproof, thermal conductive, flameretardant and insulating properties. It cures into a solid form after...
- High Temperature Electronic Potting Compound
- Durable Electronic Encapsulation Material
- Thermally Conductive Potting Solution
- Electronic Potting Compound for Advanced Circuitry
- Reliable Encapsulation Material for Electronics
- High Performance Electronic Potting Compound
- Advanced Electronic Potting Compound for Reliable Protection
Company Profile
HONG YE SILICONE is a high-tech enterprise specialized in R&D, production and sales of silicone raw materials,Which founded in 2006 by Guibin Li ,a successful entrepreneur.We excel in platinum-cured silicone technology, supplying premium addition curing silicone for film, medical and industrial sectors. FDA, ROHS and SGS certified, we provide customized solutions and reliable B2B services to global clients with strict quality control.
R & D Strength
Accelerating innovation by revolutionizing manufacturing.
Staffing
We empower companies to bring new ideas to market by offering the fastest in the world.
Electronic Potting Compound
Our Electronic Potting Compound is a professional silicone encapsulant for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix including Industrial Mold Silicone Rubber. As a premium silicone raw material, it cures into a solid layer after adding a curing agent, realizing sealing, filling and pressure-proof protection. With superior adhesion and thermal stability to PC, PMMA, PCB and CPU, its two curing types meet diverse industrial needs, serving as a reliable choice for high-performance electronic component protection.
Product Overview
Our Electronic Potting Compound is a professional silicone encapsulant for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix including Industrial Mold Silicone Rubber. As a premium silicone raw material, it cures into a solid layer after adding a curing agent, realizing sealing, filling and pressure-proof protection. With superior adhesion and thermal stability to PC, PMMA, PCB and CPU, its two curing types meet diverse industrial needs, serving as a reliable choice for high-performance electronic component protection.
Product Advantages
- 1.Comprehensive Protection: Offers excellent anti-corrosion, waterproof, moisture-proof, dust-proof, insulation, thermal conduction and shockproof effects, isolating components from harsh environments.
- 3. Extreme Temperature Resistance: Works continuously from -60℃ to 220℃, absorbing thermal stress to protect chips and welded gold wires from high-temperature cycles.
- 2. Strong Environmental Adaptability: Resists ozone and chemical erosion, maintaining stability in complex industrial conditions for long-term use.
- 4. Superior Material Quality: Low volatile content, high strength, and excellent bonding with aluminum, copper, stainless steel, ensuring durable component protection..
Technical Specifications
Curing Type: Addition curing silicone / Condensation curing silicone
Operating Temperature: -60℃ ~ 220℃
Core Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing Condition: Room temperature/heating curing, full curing in 24 hours
Material Traits: Low volatility, ozone-resistant, chemical erosion-resistant
Operating Temperature: -60℃ ~ 220℃
Core Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing Condition: Room temperature/heating curing, full curing in 24 hours
Material Traits: Low volatility, ozone-resistant, chemical erosion-resistant
Usage Steps
Step 1:Preparation: Fully stir Component A to mix settled fillers; shake Component B thoroughly for uniform consistency.
Step 2:Mixing: Blend A and B strictly by specified weight ratio to ensure stable curing effect.
Step 3:Deaeration (Optional): Place mixed adhesive in a vacuum container, deaerate at 0.01MPa for 3 minutes to remove bubbles before potting.
Step4:Potting & Curing: Pour on target components, cure at room temperature or by heating. Proceed to next process after initial curing; full curing takes 24 hours, affected by temperature and humidity.
Application Scenarios
Widely used for encapsulating, sealing and filling electronic components, especially LED display modules, CPU peripherals, power supplies, control boards and communication devices. It enhances product stability, reduces failure rates during transportation and use, helping manufacturers improve quality and cut after-sales costs.
Certifications and Compliance
The product has passed FDA and SGS food/medical grade certification, complying with international safety standards for medical and daily use silicone products. Its platinum cured formula meets environmental protection requirements, with no harmful substances released during production and use, suitable for global market sales and application.
Customization
Options
Customization Options
We offer OEM customization services. Hardness, viscosity and operation time of the cured product can be adjusted according to customer needs. Exclusive formulas for high thermal conductivity or ultra-low temperature resistance are available for personalized bulk orders..
Packaging Storage
Shenzhen Hong Ye Jie Technology Co., Ltd
FAQS
- Q1: What’s the difference between the two curing types?A1: Addition curing has faster speed and lower shrinkage for high-precision components; condensation curing is cost-effective for general encapsulation.
- Q2: How to store unused adhesive?A2: Seal A and B separately in a cool dry place. Mixed adhesive must be used at once to avoid waste.
- Q3: What if the colloid layers after storage?A3: Stir thoroughly before use—this is normal and won’t affect performance.
- Q4: Is it a hazardous material?A4: Non-hazardous for transportation. Avoid mouth/eye contact; rinse with water if accidental contact occurs.
CONTACT US
Workshop of jinxingrui company, huogang village, Luocun village, Lilin Town, Zhongkai high tech Zone, Huizhou, Guangdong, China.
Telephone
+86-755-89948294
Email
hysc@szrl.net
Mobile
+86-189 2649 6691
