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Electronic Potting Compound
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9035Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting for Glass Capacitor Dielectrics is a specialized electronic potting compound, also known as silicone potting compound and electronic encapsulation adhesive, tailored for glass capacitor dielectric encapsulation....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9030Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting for Silver Mica Capacitors is a specialized electronic potting compound, also known as silicone potting compound and electronic encapsulation adhesive, tailored for silver mica capacitor encapsulation. Crafted...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9025Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting for Supercapacitor Cells is a specialized electronic potting compound, also known as silicone potting compound andelectronic encapsulation adhesive, tailored for supercapacitor cell encapsulation. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9010Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting for Tantalum Capacitors is a specializedelectronic potting compound, also known as silicone potting compound and electronic encapsulation adhesive, tailored for tantalum capacitor encapsulation. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9020Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting for Film Capacitor Wound Cores is a specialized electronic potting compound, also known as silicone potting compound and electronic encapsulation adhesive, tailored for film capacitor wound core encapsulation....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9015Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting for Aluminum Electrolytics is a specialized electronic potting compound, also known as silicone potting compound and electronic encapsulation adhesive, tailored for aluminum electrolytic capacitor encapsulation....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-230Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Silicone for Diamond Substrate Circuits is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for diamond substrate protection....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-215Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Silicone for Ceramic Matrix Composites (CMCs) is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for CMCs protection. Crafted...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-210Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Silicone for Metal Core PCBs (MCPCBs) is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for MCPCBs protection. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9325Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Waterproof & Insulating Electronic Potting Silicone for High Temperature Cofired Ceramics (HTCC) is a high-reliability two-component RTV 2 Silicone Rubber, also known as silicone encapsulant and electronic potting compound,...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9320Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Transparent Electronic Potting Silicone for Low Temperature Cofired Ceramics (LTCC) is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for LTCC...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9315Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Thermally Conductive Electronic Potting Silicone for Thick Film Hybrids (TFH) is a high-performance two-component addition curing silicone, also known as thermally conductive potting compound and silicone encapsulant, tailored for...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9310Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Silicone for Power Quad Flat Packages (PQFP) is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for PQFP protection. Crafted...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9305Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Silicone for Dual Flat No-Lead Packages (DFN) is a high-reliability two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for DFN protection. Crafted...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9055Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Silicone for Quad Flat No-Lead Packages (QFN) is a high-performance two-component addition curing silicone, also known as silicone encapsulant andelectronic potting compound, tailored for QFN protection. Crafted...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9050Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Silicone for Small Outline Integrated Circuits (SOIC) is a high-reliability two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for SOIC protection....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9045Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Flame-Retardant Electronic Potting Silicone for Plastic Leaded Chips (PLC) is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for PLC...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9040Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Chip-on-Board (COB) Assemblies is a high-reliability two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for COB protection. Crafted...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9030Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Land Grid Arrays (LGA) is a high-reliability two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for LGA protection. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9035Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Quad Flat Packages (QFP) is a high-reliability two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for QFP protection. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9025Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Ball Grid Arrays (BGA) is a high-reliability two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for BGA protection. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9020Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Wire Bond Interconnects is a high-reliability two-componentaddition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for wire bond protection. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9015Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Thin-Film Resistor Networks is a high-precision two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for thin-film resistor network...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9010Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Multilayer Ceramic Capacitors (MLCC) is a high-reliability two-component addition curing silicone, also known as silicone encapsulant andelectronic potting compound, tailored for MLCC protection....
- Electronic Potting for Glass Capacitor Dielectrics
- Electronic Potting for Silver Mica Capacitors
- Electronic Potting for Supercapacitor Cells
- Electronic Potting for Tantalum Capacitors
- Electronic Potting for Film Capacitor Wound Cores
- Electronic Potting for Aluminum Electrolytics
- Electronic Potting for Diamond Substrate Circuits
- Electronic Potting for Ceramic Matrix Composites
- Electronic Potting for Metal Core PCBs
- Electronic Potting for High Temperature Cofired Ceramics
- Electronic Potting for Low Temperature Cofired Ceramics
- Electronic Potting for Thick Film Hybrids
- Electronic Potting for Power Quad Flat Packages
- Electronic Potting for Dual Flat No-Lead Packages
- Electronic Potting for Quad Flat No-Lead Packages
- Electronic Potting for Small Outline Integrated Circuits
- Electronic Potting for Plastic Leaded Chips
- Electronic Potting for Chip-on-Board Assemblies
- Electronic Potting for Land Grid Arrays
- Electronic Potting for Quad Flat Packages
- Electronic Potting for Ball Grid Arrays
- Electronic Potting for Wire Bond Interconnects
- Electronic Potting for Thin-Film Resistor Networks
- Electronic Potting for Multilayer Ceramic Capacitors
Company Profile
HONG YE SILICONE is a high-tech enterprise specialized in R&D, production and sales of silicone raw materials,Which founded in 2006 by Guibin Li ,a successful entrepreneur.We excel in platinum-cured silicone technology, supplying premium addition curing silicone for film, medical and industrial sectors. FDA, ROHS and SGS certified, we provide customized solutions and reliable B2B services to global clients with strict quality control.
R & D Strength
Accelerating innovation by revolutionizing manufacturing.
Staffing
We empower companies to bring new ideas to market by offering the fastest in the world.
Electronic Potting Compound
Our Electronic Potting Compound is a professional silicone encapsulant for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix including Industrial Mold Silicone Rubber. As a premium silicone raw material, it cures into a solid layer after adding a curing agent, realizing sealing, filling and pressure-proof protection. With superior adhesion and thermal stability to PC, PMMA, PCB and CPU, its two curing types meet diverse industrial needs, serving as a reliable choice for high-performance electronic component protection.
Product Overview
Our Electronic Potting Compound is a professional silicone encapsulant for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix including Industrial Mold Silicone Rubber. As a premium silicone raw material, it cures into a solid layer after adding a curing agent, realizing sealing, filling and pressure-proof protection. With superior adhesion and thermal stability to PC, PMMA, PCB and CPU, its two curing types meet diverse industrial needs, serving as a reliable choice for high-performance electronic component protection.
Product Advantages
- 1.Comprehensive Protection: Offers excellent anti-corrosion, waterproof, moisture-proof, dust-proof, insulation, thermal conduction and shockproof effects, isolating components from harsh environments.
- 3. Extreme Temperature Resistance: Works continuously from -60℃ to 220℃, absorbing thermal stress to protect chips and welded gold wires from high-temperature cycles.
- 2. Strong Environmental Adaptability: Resists ozone and chemical erosion, maintaining stability in complex industrial conditions for long-term use.
- 4. Superior Material Quality: Low volatile content, high strength, and excellent bonding with aluminum, copper, stainless steel, ensuring durable component protection..
Technical Specifications
Curing Type: Addition curing silicone / Condensation curing silicone
Operating Temperature: -60℃ ~ 220℃
Core Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing Condition: Room temperature/heating curing, full curing in 24 hours
Material Traits: Low volatility, ozone-resistant, chemical erosion-resistant
Operating Temperature: -60℃ ~ 220℃
Core Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing Condition: Room temperature/heating curing, full curing in 24 hours
Material Traits: Low volatility, ozone-resistant, chemical erosion-resistant
Usage Steps
Step 1:Preparation: Fully stir Component A to mix settled fillers; shake Component B thoroughly for uniform consistency.
Step 2:Mixing: Blend A and B strictly by specified weight ratio to ensure stable curing effect.
Step 3:Deaeration (Optional): Place mixed adhesive in a vacuum container, deaerate at 0.01MPa for 3 minutes to remove bubbles before potting.
Step4:Potting & Curing: Pour on target components, cure at room temperature or by heating. Proceed to next process after initial curing; full curing takes 24 hours, affected by temperature and humidity.
Application Scenarios
Widely used for encapsulating, sealing and filling electronic components, especially LED display modules, CPU peripherals, power supplies, control boards and communication devices. It enhances product stability, reduces failure rates during transportation and use, helping manufacturers improve quality and cut after-sales costs.
Certifications and Compliance
The product has passed FDA and SGS food/medical grade certification, complying with international safety standards for medical and daily use silicone products. Its platinum cured formula meets environmental protection requirements, with no harmful substances released during production and use, suitable for global market sales and application.
Customization
Options
Customization Options
We offer OEM customization services. Hardness, viscosity and operation time of the cured product can be adjusted according to customer needs. Exclusive formulas for high thermal conductivity or ultra-low temperature resistance are available for personalized bulk orders..
Packaging Storage
Shenzhen Hong Ye Jie Technology Co., Ltd
FAQS
- Q1: What’s the difference between the two curing types?A1: Addition curing has faster speed and lower shrinkage for high-precision components; condensation curing is cost-effective for general encapsulation.
- Q2: How to store unused adhesive?A2: Seal A and B separately in a cool dry place. Mixed adhesive must be used at once to avoid waste.
- Q3: What if the colloid layers after storage?A3: Stir thoroughly before use—this is normal and won’t affect performance.
- Q4: Is it a hazardous material?A4: Non-hazardous for transportation. Avoid mouth/eye contact; rinse with water if accidental contact occurs.
CONTACT US
Workshop of jinxingrui company, huogang village, Luocun village, Lilin Town, Zhongkai high tech Zone, Huizhou, Guangdong, China.
Telephone
+86-755-89948294
Email
hysc@szrl.net
Mobile
+86-189 2649 6691
