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Electronic Potting Compound
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-230Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Voltage Reference Sources is a high-stability two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for voltage reference source...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-215Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Current Sense Amplifiers is a high-precision two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for current sense amplifier...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9325Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Crystal Oscillator Circuits is a high-stability two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for crystal oscillator circuit...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9320Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Precision Resistor Networks is a high-precision two-componentaddition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for precision resistor network...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9315Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for High-Speed Digital Buses is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for high-speed digital bus...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9310Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Rigid-Flex Circuits is a high-performance two-componentaddition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for rigid-flex circuit protection. Crafted...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9305Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Through-Silicon Vias (TSV) is a high-precision two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for TSV protection. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9055Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Wafer-Level Packaging (WLP) is a high-performance two-component liquid silicone (conductive type), also known as silicone encapsulant and electronic potting compound, tailored for WLP protection....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9050Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for System-in-Package (SiP) Designs is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for SiP protection. Crafted...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9045Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Flip-Chip Assemblies is a high-performance two-component addition curing silicone (flame-retardant type), also known as silicone encapsulant and electronic potting compound, tailored for flip-chip...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9040Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Embedded Passive Devices (EPDs) is a high-precision two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for EPD protection. Crafted...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9035Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Multi-Chip Modules (MCMs) is a high-precision two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for MCM protection. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9030Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for High-Frequency Circuits is a high-precision two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for high-frequency circuit protection....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9025Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Extreme Temperature Ranges is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for extreme temperature scenarios....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9020Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for High-Vibration Environments is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for vibration-prone electronic...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9015Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Miniature Component Arrays is a high-precision two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for miniature component packaging....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9010Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Hermetic Sealing Applications is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for hermetic sealing scenarios....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-230Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for High-Density Interconnects (HDIs) is a high-precision two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for HDI boards. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9320Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Vibrating Sample Magnetometers (VSMs) is a high-precision two-component high transparency mold silicone, also known as silicone encapsulant and electronic potting compound, tailored for VSM equipment....
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9325Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Differential Mobility Analyzers (DMAs) is a high-precision two-component silicone encapsulant, also known as electronic potting compound and electronic encapsulation adhesive, tailored for DMA...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-215Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Free-Electron Lasers (FELs) is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for FEL equipment. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9315Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Optical Coherence Tomography (OCT) is a high-precision two-component thermally conductive potting compound, also known as silicone encapsulant and electronic potting compound, tailored for OCT...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9310Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Plasma Focus Devices (PFDs) is a high-performance two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for PFD equipment. Crafted from...
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Brand:HONG YE SILICONEMin. Order:KilogramModel No:HY-9305Transportation:Ocean,Land,Air,ExpressPackaging:1kg/5kg/25kg/200kgSupply Ability:100TonPlace of Origin:HUIZHOUProductivity:100TONHONG YE SILICONE Electronic Potting Compound for Micro-Electrode Arrays (MEAs) is a high-precision two-component addition curing silicone, also known as silicone encapsulant and electronic potting compound, tailored for MEA equipment. Crafted from...
- Electronic Potting for Voltage Reference Sources
- Electronic Potting for Current Sense Amplifiers
- Electronic Potting for Crystal Oscillator Circuits
- Electronic Potting for Precision Resistor Networks
- Electronic Potting for High-Speed Digital Buses
- Electronic Potting for Rigid-Flex Circuits
- Electronic Potting for Through-Silicon Vias
- Electronic Potting for Wafer-Level Packaging
- Electronic Potting for System-in-Package Designs
- Electronic Potting for Flip-Chip Assemblies
- Electronic Potting for Embedded Passive Devices
- Electronic Potting for Multi-Chip Modules
- Electronic Potting for High-Frequency Circuits
- Electronic Potting for Extreme Temperature Ranges
- Electronic Potting for High-Vibration Environments
- Electronic Potting for Miniature Component Arrays
- Electronic Potting for Hermetic Sealing Applications
- Electronic Potting for High-Density Interconnects
- Electronic Potting for Vibrating Sample Magnetometers
- Electronic Potting for Differential Mobility Analyzers
- Electronic Potting for Free-Electron Lasers
- Electronic Potting for Optical Coherence Tomography
- Electronic Potting for Plasma Focus Devices
- Electronic Potting for Micro-Electrode Arrays
Company Profile
HONG YE SILICONE is a high-tech enterprise specialized in R&D, production and sales of silicone raw materials,Which founded in 2006 by Guibin Li ,a successful entrepreneur.We excel in platinum-cured silicone technology, supplying premium addition curing silicone for film, medical and industrial sectors. FDA, ROHS and SGS certified, we provide customized solutions and reliable B2B services to global clients with strict quality control.
R & D Strength
Accelerating innovation by revolutionizing manufacturing.
Staffing
We empower companies to bring new ideas to market by offering the fastest in the world.
Electronic Potting Compound
Our Electronic Potting Compound is a professional silicone encapsulant for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix including Industrial Mold Silicone Rubber. As a premium silicone raw material, it cures into a solid layer after adding a curing agent, realizing sealing, filling and pressure-proof protection. With superior adhesion and thermal stability to PC, PMMA, PCB and CPU, its two curing types meet diverse industrial needs, serving as a reliable choice for high-performance electronic component protection.
Product Overview
Our Electronic Potting Compound is a professional silicone encapsulant for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix including Industrial Mold Silicone Rubber. As a premium silicone raw material, it cures into a solid layer after adding a curing agent, realizing sealing, filling and pressure-proof protection. With superior adhesion and thermal stability to PC, PMMA, PCB and CPU, its two curing types meet diverse industrial needs, serving as a reliable choice for high-performance electronic component protection.
Product Advantages
- 1.Comprehensive Protection: Offers excellent anti-corrosion, waterproof, moisture-proof, dust-proof, insulation, thermal conduction and shockproof effects, isolating components from harsh environments.
- 3. Extreme Temperature Resistance: Works continuously from -60℃ to 220℃, absorbing thermal stress to protect chips and welded gold wires from high-temperature cycles.
- 2. Strong Environmental Adaptability: Resists ozone and chemical erosion, maintaining stability in complex industrial conditions for long-term use.
- 4. Superior Material Quality: Low volatile content, high strength, and excellent bonding with aluminum, copper, stainless steel, ensuring durable component protection..
Technical Specifications
Curing Type: Addition curing silicone / Condensation curing silicone
Operating Temperature: -60℃ ~ 220℃
Core Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing Condition: Room temperature/heating curing, full curing in 24 hours
Material Traits: Low volatility, ozone-resistant, chemical erosion-resistant
Operating Temperature: -60℃ ~ 220℃
Core Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing Condition: Room temperature/heating curing, full curing in 24 hours
Material Traits: Low volatility, ozone-resistant, chemical erosion-resistant
Usage Steps
Step 1:Preparation: Fully stir Component A to mix settled fillers; shake Component B thoroughly for uniform consistency.
Step 2:Mixing: Blend A and B strictly by specified weight ratio to ensure stable curing effect.
Step 3:Deaeration (Optional): Place mixed adhesive in a vacuum container, deaerate at 0.01MPa for 3 minutes to remove bubbles before potting.
Step4:Potting & Curing: Pour on target components, cure at room temperature or by heating. Proceed to next process after initial curing; full curing takes 24 hours, affected by temperature and humidity.
Application Scenarios
Widely used for encapsulating, sealing and filling electronic components, especially LED display modules, CPU peripherals, power supplies, control boards and communication devices. It enhances product stability, reduces failure rates during transportation and use, helping manufacturers improve quality and cut after-sales costs.
Certifications and Compliance
The product has passed FDA and SGS food/medical grade certification, complying with international safety standards for medical and daily use silicone products. Its platinum cured formula meets environmental protection requirements, with no harmful substances released during production and use, suitable for global market sales and application.
Customization
Options
Customization Options
We offer OEM customization services. Hardness, viscosity and operation time of the cured product can be adjusted according to customer needs. Exclusive formulas for high thermal conductivity or ultra-low temperature resistance are available for personalized bulk orders..
Packaging Storage
Shenzhen Hong Ye Jie Technology Co., Ltd
FAQS
- Q1: What’s the difference between the two curing types?A1: Addition curing has faster speed and lower shrinkage for high-precision components; condensation curing is cost-effective for general encapsulation.
- Q2: How to store unused adhesive?A2: Seal A and B separately in a cool dry place. Mixed adhesive must be used at once to avoid waste.
- Q3: What if the colloid layers after storage?A3: Stir thoroughly before use—this is normal and won’t affect performance.
- Q4: Is it a hazardous material?A4: Non-hazardous for transportation. Avoid mouth/eye contact; rinse with water if accidental contact occurs.
CONTACT US
Workshop of jinxingrui company, huogang village, Luocun village, Lilin Town, Zhongkai high tech Zone, Huizhou, Guangdong, China.
Telephone
+86-755-89948294
Email
hysc@szrl.net
Mobile
+86-189 2649 6691
