Eco-Friendly Liquid Potting Silicone for Electronic PCB

Eco-Friendly Liquid Potting Silicone for Electronic PCB

Name: Liquid tank adhesive 9400（2）
Uploaded: 2026-01-28T06:31:21+08:00
Description: HONG YE SILICONE Electronic Encapsulation Adhesive is high-performance Addition curing silicone crafted from top-grade

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	shenzhen

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Product Description

Product Attributes

Model No.: HY-9400/HY-9405

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	1kg/5kg/25kg/200kg
Picture Example	:

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Liquid tank adhesive 9400（2）

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Product Description

HONG YE SILICONE Electronic Encapsulation Adhesive is high-performance Addition Curing Silicone crafted from top-grade Silicone raw materials. As classic Liquid Tank Silicone and Filter Potting Silicone, it is a reliable Electronic Potting Compound with RTV 2 Silicone Rubber property. Low viscosity, dual curing and non-toxic formula ensure easy operation and eco-safety. It bonds metal, PC, ABS and PVC well, widely used in LCD, electronics and high-temperature equipment for permanent sealing protection.

Eco-Friendly Filter Potting Silicone for Electronic Encapsulation

Product Overview

Our Silicone Encapsulant is professional two-component liquid silicone , also regarded as Liquid Tank Adhesive and Silicone Encapsulant. Transparent Part A and customizable Part B enable flexible application in liquid tank filter, precision electronic components and power module potting. Eco-friendly formula with high toughness guarantees perfect sealing effect after complete curing.

Technical Specifications

Weight mixing ratio 1:1 for A and B components; vacuum degassing 3 minutes at 0.08MPa. Natural curing 3-8 hours at normal temperature, fast curing 20 minutes under high temperature. Standard packaging from 1KG to 200KG, 1 year sealed shelf life, non-hazardous transportation.

Product Features

No harmful by-products generated during curing, safe for electronic industry application. Moderate softness and outstanding resilience can buffer stress from thermal expansion and contraction without cracking. Good waterproof, moisture-proof and high-low temperature resistant performance for long-term service.

How to Use

Stir Part A and Part B evenly separately to prevent material stratification.

Mix two components in accurate 1:1 weight proportion.

Stir thoroughly and remove air bubbles before pouring construction.

Adopt heating curing mode in winter to accelerate molding speed.

Application Scenarios

Covers optical electronics, LCD liquid crystal manufacturing, precision element sealing and various high-temperature equipment bonding. It effectively enhances product insulation and shockproof ability, raising overall product competitiveness for buyers.

Certifications and Compliance

Conform to international environmental norms and industrial standards, fully qualified for global market export and matching.