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Home> Products> Electronic Potting Compound> Mid Viscosity Electronic Potting Compound
Mid Viscosity Electronic Potting Compound
Mid Viscosity Electronic Potting Compound
Mid Viscosity Electronic Potting Compound
Mid Viscosity Electronic Potting Compound
Mid Viscosity Electronic Potting Compound
Mid Viscosity Electronic Potting Compound

Mid Viscosity Electronic Potting Compound

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9015

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound
Product Description
HONG YE SILICONE’s Mid Viscosity Electronic Potting Compound is a premium balanced flow protective encapsulation material and moderate viscosity module Potting Compound. This versatile application circuit protection silicone features ideal fluidity that avoids overflow and filling deficiency. It delivers stable insulation, heat dissipation and waterproof performance across -60℃ to 220℃. We also provide standard Electronic potting compound, heat-conductive Thermally Conductive Potting Compound, adhesive Electronic Encapsulation Adhesive and universal Silicone Encapsulant for full electronic protection solutions.
 
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Product Overview

This two-component mid-viscosity silicone potting material includes addition and condensation curing formulas. It is designed to solve the construction defects of ultra-low and high-viscosity potting glues. With moderate fluidity, it realizes uniform filling for common electronic modules, perfectly fitting PCB, CPU, PC and PMMA substrates. It absorbs thermal cycling internal stress, protecting chips and bonding wires, and features low volatility and high structural strength for long-term stable operation.

Technical Specifications

As a versatile application circuit protection silicone, it adopts balanced mid-viscosity formula with smooth flow and no sagging or overflow. It boasts excellent ozone and chemical corrosion resistance, stable thermal stability and insulation. The cured layer features high bonding strength with various metals and plastics, shockproof and dustproof performance. Viscosity, hardness and operating time support personalized customization for diverse production needs.
 
electronic silicone

Product Features & Advantages

1. Balanced Flow Performance: This balanced flow protective encapsulation material achieves free pouring without overflow or unfilled gaps, optimizing construction efficiency.
2. Universal Application Adaptability: The moderate viscosity module potting compound suits most standard electronic modules with strong scene compatibility.
3. All-Round Protection: Integrates waterproof, moisture-proof, anti-corrosion, heat-dissipating and anti-shock functions to adapt to complex working environments.
4. Stable Structural Performance: Low volatile content and high toughness effectively resist temperature cycle stress, avoiding cracking and peeling failure.

Step-by-Step Application Process

1. Pre-Mixing Preparation: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to ensure complete curing and stable performance.
3. Vacuum Defoaming: Stir evenly and defoam for 3 minutes under 0.01MPa vacuum to remove bubbles for seamless encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Product Value

Ideal for ordinary precision electronic components, circuit modules, instrument electronics and daily electronic equipment. Its moderate viscosity simplifies construction process, reduces manual operation errors and material waste, improves production yield, and effectively lowers manufacturers’ overall production and maintenance costs.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international industrial standards, meeting global electronic manufacturing safety and environmental requirements.

Customization Options

We support customized viscosity, curing hardness and operating time to match different module structures and encapsulation processes.

Production Process

We adopt high-purity raw materials and standardized production. Each batch undergoes strict fluidity, curing and protection performance tests to ensure stable industrial-grade quality.

FAQ

Q1: What is the core advantage of mid-viscosity potting silicone?
A: As a balanced flow protective encapsulation material, it avoids the flaws of too thin overflow or too thick
poor fluidity, balancing construction efficiency and filling effect.
Q2: Is it suitable for most conventional electronic modules?
A: Yes. This versatile application circuit protection silicone is the preferred universal potting material for most
standard electronic encapsulation scenarios.
Q3: Does colloidal stratification affect usage performance?
A: Stratification is a normal storage phenomenon. Even stirring before use will not change its viscosity and
protective performance.
 
 
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