Product Overview
This two-component industrial-grade silicone potting material includes addition and condensation curing formulas. It is specially developed for heavy-duty industrial electronic encapsulation, sealing and pressure resistance. It delivers superior adhesion and thermal stability on PCB, CPU, PC and PMMA, as well as various metal substrates. Designed for long-term robust service, it absorbs thermal cycling stress effectively to protect internal chips and bonding wires from harsh environmental damage.
Technical Specifications
As a reliable tough environment circuit protection material, it features high mechanical strength, low volatile content and excellent ozone & chemical erosion resistance. It maintains stable insulation, heat dissipation and shockproof performance under heavy load and extreme temperature cycling. The cured heavy load protective encapsulation layer resists aging and deformation. Viscosity, hardness and operating time support industrial customized adjustment.
Product Features & Advantages
1. Heavy Load Resistance: This robust service module potting compound withstands long-term mechanical pressure and vibration for industrial scenario durability.
2. Harsh Environment Adaptability: Excellent waterproof, dustproof and anti-corrosion properties suit outdoor and factory harsh working conditions.
3. Wide Temperature Stability: Operates continuously from -60℃ to 220℃, relieving thermal stress to avoid circuit cracking damage.
4. Superior Bonding Performance: Firmly adheres to aluminum, copper, stainless steel and circuit boards, preventing peeling in long-term industrial operation.
Step-by-Step Usage Process
1. Pre-Mixing Preparation: Fully stir component A to homogenize settled fillers and shake component B thoroughly before use.
2. Accurate Proportioning: Mix A and B components strictly by standard weight ratio to ensure complete industrial-grade curing performance.
3. Vacuum Defoaming: Stir evenly and defoam for 3 minutes under 0.01MPa vacuum to achieve bubble-free industrial encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.
Application Scenarios & Commercial Value
Widely applied in industrial control modules, heavy machinery electronics, outdoor power equipment and mining electronic devices. It reduces equipment failure rates caused by harsh environments and heavy loads, extends service life of industrial electronics, and lowers manufacturers’ long-term operation and maintenance costs.
Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting strict industrial electronic manufacturing specifications.
Customization Options
We support personalized customization of viscosity, curing hardness and operating time to adapt to diverse industrial encapsulation requirements.
Production Process
Adopting industrial-grade raw materials and standardized production, each batch undergoes strict aging and load resistance tests to guarantee stable heavy-duty protection performance.
FAQ
Q1: What is the difference between industrial-duty and ordinary potting silicone?
A: It is a dedicated tough environment circuit protection material, with higher mechanical strength and aging
resistance for long-term heavy-load industrial operation.
Q2: Can it work stably in frequent temperature cycling environments?
A: Yes. Its high-tough formula effectively absorbs thermal stress, resisting cracking and aging under
repeated extreme temperature changes.
Q3: Is colloidal stratification normal during long-term storage?
A: Yes. Stirring evenly before use will not affect its industrial-grade protection and bonding performance.