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Home> Products> Electronic Potting Compound> Semi Rigid Electronic Potting Silicone
Semi Rigid Electronic Potting Silicone
Semi Rigid Electronic Potting Silicone
Semi Rigid Electronic Potting Silicone
Semi Rigid Electronic Potting Silicone
Semi Rigid Electronic Potting Silicone
Semi Rigid Electronic Potting Silicone

Semi Rigid Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9020

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound1
Product Description
HONG YE SILICONE’s Semi Rigid Electronic Potting Silicone is a professional balanced support circuit protection material and flexible rigid module Potting Compound. It forms a stable medium hardness protective encapsulation layer, perfectly balancing flexible buffering and rigid structural support. It operates stably at -60℃ to 220℃ with insulation, heat dissipation and anti-corrosion performance. Our brand also provides premium Electronic Potting Compound, high-efficiency Thermally Conductive Potting Compound, versatile Electronic Encapsulation Adhesive and durable Silicone Encapsulant for full industrial electronic protection solutions.
 
HY-factory

Product Overview

This two-component semi-rigid silicone potting material includes addition and condensation curing types. Different from fully soft or rigid potting glue, it features unique semi-rigid toughness after curing. It is widely used for encapsulation, sealing and pressure resistance of electronic components, with excellent adhesion and thermal stability on PCB, CPU, PC and PMMA substrates. It effectively absorbs thermal cycling stress to protect chips and bonding wires, with low volatility and high comprehensive structural stability.

Technical Specifications

As a balanced support circuit protection material, it delivers moderate hardness with both shock buffering and anti-extrusion capabilities. It features outstanding ozone and chemical erosion resistance, stable wide-temperature performance and excellent heat dissipation & insulation. It firmly bonds with aluminum, copper, stainless steel and plastic substrates without peeling. Hardness, viscosity and operating time support fully personalized customization for diverse module packaging needs.
 
electronic silicone

Product Features & Advantages

1. Balanced Rigidity & Toughness: This flexible rigid module potting compound avoids the defects of overly soft instability and overly rigid easy cracking.
2. Medium Hardness Protection: The uniform medium hardness protective encapsulation layer provides reliable structural support and effective shock absorption.
3. All-Round Environmental Resistance: Integrates waterproof, dustproof, anti-corrosion and high-low temperature resistant functions for long-term stable circuit protection.
4. Low Volatility & High Strength: High-purity formula with few volatile substances ensures safe and stable operation of precision electronic devices.

Step-by-Step Usage Process

1. Pre-Stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B before mixing.
2. Accurate Proportioning: Mix A and B components strictly in standard weight ratio to ensure stable semi-rigid toughness after curing.
3. Vacuum Defoaming: Place mixed compound in a 0.01MPa vacuum container for 3 minutes to remove bubbles for seamless encapsulation.
4. Standard Curing: Cure at room temperature or heating condition; full curing takes 24 hours, affected by ambient temperature and humidity.

Application Scenarios & Commercial Value

Ideal for automotive electronics, household appliance modules, industrial control circuits and medium-load electronic equipment. Its balanced performance solves the failure problems of soft glue insufficient support and rigid glue easy cracking, reduces equipment damage rates, improves product durability, and cuts manufacturers’ after-sales and replacement costs.

Certifications and Compliance

All HONG YE SILICONE products comply with ISO9001, CE and RoHS international standards, meeting global industrial electronic manufacturing safety and environmental specifications.

Customization Options

We support customized viscosity, curing hardness and operating time to adapt to different electronic module structural protection requirements.

Production Process

Adopting standardized dust-free production, each batch undergoes strict hardness, toughness and temperature cycle tests to ensure consistent semi-rigid protective performance.

FAQ

Q1: What is the core advantage of semi-rigid potting silicone?
A: It is a balanced support circuit protection material, combining flexible shock absorption and rigid structural
support to adapt to complex working conditions.
Q2: Will temperature cycling cause cracking of the cured layer?
A: No. Its unique semi-rigid toughness effectively absorbs thermal stress, resisting cracking and peeling
during long-term temperature alternation.
Q3: Is colloidal stratification normal after long storage?
A: Yes. Even stirring before use can restore full performance with no impact on hardness, adhesion and
protection effects.
 
 
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