Low Thermal Resistance Protective Compound

Low Thermal Resistance Electronic Potting Silicone

HONG YE SILICONE Low Thermal Resistance Electronic Potting Silicone is a two-component addition-cure low thermal resistance encapsulating material. As a premium Silicone Encapsulant and Thermally Conductive Potting Compound, it optimizes thermal...

Low Stress Electronic Potting Compound

HONG YE SILICONE’s Low Stress Electronic Potting Compound is a professional delicate component circuit protection silicone and upgraded stress relieved module potting compound. Adoptinggentle cure protective encapsulation material formula, it...

Low Odor Electronic Potting Compound

HONG YE SILICONE’s Low Odor Electronic Potting Compound is an eco-friendly, safe encapsulation solution optimized for indoor and closed workshop production. As a mild fume protective encapsulation material and workplace friendly module potting...

High Thermal Conductivity Electronic Potting Compound

HONG YE SILICONE’s High Thermal Conductivity Electronic Potting Compound is a professional heat-dissipating thermally conductive potting compound for high-heat electronic components. Made of high-purity liquid silicone and stable RTV 2 silicone...

PCB Protective Potting Silicone Compound

HONG YE SILICONE Circuit Board Potting Silicone is a high-performance two-component silicone (available in addition and condensation curing types), designed for potting all electronic products including circuit boards, electronic ballasts,...

Low Viscosity Liquid Silicone Potting Compound for LED

Industrial grade Potting Compound from HONG YE SILICONE is dual-part liquid silicone adopting Addition curing silicone technology. Serving as Jelly Silicone Gel and Liquid Tank Silicone, it uses high-purity Silicone raw materials to become premium...

Low Viscosity Electronic Potting Compound

HONG YE SILICONE’s Low Viscosity Electronic Potting Compound is a high-fluidity bubble free module potting compound developed for compact and dense electronic structures. It features easy flow thin section encapsulation and delivers reliable tight...

High Flame Resistance Electronic Potting Compound

HONG YE SILICONE’s High Flame Resistance Electronic Potting Compound is a fire-rated two-part silicone encapsulant formulated for high-risk electronic working environments. Featuring self extinguishing encapsulation grade and certified UL94 V0...

Fast Thermal Cure Electronic Potting Compound

HONG YE SILICONE’s Fast Thermal Cure Electronic Potting Compound is a high-efficiency two-part addition-cure silicone optimized for mass electronic assembly lines. Featured with heat accelerated crosslinking encapsulation technology, this potting...

Thermal Shock Resistant Electronic Potting Compound

HONG YE SILICONE’s Thermal Shock Resistant Electronic Potting Compound is an extreme temperature cycle resistant silicone potting compound tailored for electronics with frequent temperature changes. Made of premium liquid silicone and high-stability...

Low Thermal Expansion Electronic Potting Silicone

HONG YE SILICONE’s Low Thermal Expansion Electronic Potting Silicone is a high-precision encapsulation material designed for temperature-sensitive electronic modules. It delivers professional coefficient matched protective encapsulation,...

Low Shrinkage Electronic Potting Compound

HONG YE SILICONE Low Shrinkage Electronic Potting Silicone is a precision-grade two-part silicone engineered as a dimensionally stable encapsulation material. This innovative formula realizes cure contraction minimized protection during full curing,...